Desktop reactive ion etching RIE system / resist ashing / material surface activation / plasma ..

OG-ACE compact desktop reactive ion P / N: OG-ACE compact desktop reactive ion etching (RIE) system Compact Table-Top RIE Systems ACE desktop multifunction plasma processing system basic application A - Ashing Photoresist Ashing? , Activation activated surface C -? Cleaning plasma cleaning E -??? Etching Plasma etching isotropic plasma etching (Isotropic Plasma Etching) anisotropic reactive ion etching (Anisotropic RIE) ACE multifunction desktop plasma treatment ? System for other applications to remove organic matter Organic Removal;? PDMS bonding PDMS Bonding;? organics pre-bonding Oxides Pre-Bonding;? Failure Analysis Failure Analysis;? Electronic devices and was purged Devices, Hybrids Cleaning ACE plasma system technical specifications advantage? Standard RF power: 10 ~ 150W @ 13.56 MHz (moderate power, low price compared with 300W); automatic operation Timer:? RF power actual discharge, after cabin glow, start time and the timing; parameter display:? knob to display radio power setting, the actual power cabin, the cabin vacuum degree (compared with the touch screen is slightly simplified, but affordable to meet the basic functional needs); LED System self peripheral cards:? LED display for system fault detection module status (no professional maintenance, according to the LED display case to determine failures and take corrective action); vacuum treatment cabin Building material:? pods using anodized 6061-T6 aircraft-grade aluminum stabilized (material properties, and will not work with electronic components dual purpose stand, different process applications namely, the standard treatment for plasma process, reactive ion etching (RIE) Process (only by manual switching, no complicated: sample bracket; material react, causing secondary pollution)? stable performance); supporting the vacuum pump using a process gas:? atmosphere, argon, nitrogen, reactive gases such as oxygen and fluorinated gases such as carbon tetrafluoride (pumping speed of 166 l / min, 5.8 CFM, 10 m3 / hr , vacuum up to 5x10-4 Torr, 6.7x10-2 Pa, .0006 mbar); quickly evacuated vacuum chamber, to achieve plasma glow;? system through safety testing machine by CE certification; if the response to a compact desktop OG-ACE interested ion etching (RIE) system, please ask us for more details! Rome Technology (Beijing) Co., Ltd. (Materials Science Department) Tel: 010-57130073 13910046648 Fax: 010-58144085 QQ: 70609221 E-mail: sale@tungroma.com Website: www.tungroma.com sub-etching (RIE) system Compact Table-Top RIE Systems