Cylindrical Desktop reactive ion etching RIE / etch / plasma hybrid cleaning / Plasma clearance ..

Description: cylindrical cavity body Desktop reactive ion etching (RIE) system VHF series cylindrical cavity body Desktop reactive ion etching (RIE) system defines a new desktop reactive ion etching (RIE) system cylindrical plasma treatment. The Desktop reactive ion etching (RIE) system is based on the desktop as reactive ion etching (RIE) system modular design concept, with a common cylindrical Desktop reactive ion etching (RIE) system as a basis for reactive ion etching (RIE ) device can be used with a variety of structures and the vacuum reaction chamber RF electrode module easily inserted into the cylindrical Desktop reactive ion etching (RIE) system equipment. The cylindrical Desktop reactive ion etching (RIE) system equipment can handle a variety of plasma processing technology, high maintainability and attractive price advantage, any other cylindrical Desktop reactive ion etching (RIE) system equipment can not be compared. Cylindrical Desktop reactive ion etching (RIE) system equipment has the following characteristics? Interchangeable cylindrical Desktop reactive ion etching (RIE) system vacuum reaction chamber and RF electrode modular design? Optional different materials, reactive ion etching (RIE) system vacuum chamber: stainless steel, aluminum, anodized aluminum multiple RF electrode configurations:? cylindrical cage (cage) electrode tray (tray) electrode, reactive ion etching (RIE) type electrode, Downstream formula (Downstream) electrode? mature cylindrical Desktop reactive ion etching (RIE) process technology program? reliable cylindrical Desktop reactive ion etching (RIE) system components? cylindrical Desktop reactive ion etching (RIE ) endpoint detection system? Desktop reactive ion etching (RIE) system supporting the RF power matching Network? cylindrical Desktop reactive ion etching (RIE) system downstream (Downstream) pressure control? cylindrical Desktop reactive ion etching (RIE ) The system uses computer control system? cylindrical Desktop reactive ion etching (RIE) system more optional vacuum pump selected cylindrical Desktop reactive ion etching (RIE) system before the plasma treatment process research and technological research, the user a strong need for a highly diverse functions, but also reliable desktop reactive ion etching (RIE) system development tools. Treatment of the changing needs of a plasma process, select a desktop reactive ion etching (RIE) system must be able to handle a wide range of plasma process parameters, and can be extremely high degree of repeatability verification plasma treatment process; and easily be modified to the new requirements of the plasma treatment process. Dry RIE reactive ion etching cylindrical desktop (RIE) system (RIE) process execution system can meet these demanding requirements of reactive ion etching (RIE) task. Plasma ashing organic, hybrid circuits and other cylindrical Desktop reactive ion etching (RIE) system is a tool for research, process development or small quantities photoresist strip and remove scum, plasma isotropic etching, plasma cleaning, printed circuit decontamination, failure analysis, ionic surfactants and other plastics processing and modification, polymer deposition and other extensive plasma applications. Cylindrical Desktop reactive ion etching (RIE) system provides a unique new modular approach to achieve a cylindrical ion systems. Cylindrical Desktop reactive ion etching (RIE) system with two different versions of the radio frequencies, namely low version of 30kHz low frequency RF power and high frequency 13.56 MHz RF power supply system. Cylindrical Desktop reactive ion etching (RIE) system can accommodate 203 mm (8 inches) or smaller substrate plasma processing. Cylindrical Desktop reactive ion etching (RIE) system, choose a mature, high-quality components, modular components, versatile vacuum chamber - electrode design, small size, automation and field-proven technology of plasma program will make a cylinder Desktop reactive ion etching (RIE) system has become a most preferred plasma process engineer desktop reactive ion etching (RIE) system. Cylindrical Desktop reactive ion etching (RIE) system applications multi-module design and optional cylindrical vacuum chamber and electrode configurations Desktop reactive ion etching (RIE) system to meet a wide range of plasma process conditions. The plasma treatment processes range from simple plasma surface cleaning to complex submicron reactive ion etching (RIE) etching. Mature technology programs, best quality components, multi-module system offers the highest uptime guarantee reliability reactive ion etching (RIE) system, repeatability, and maintainability. A typical plasma process include:? Plasma descum plasma photoresist ashing plasma surface treatment, plasma anisotropic and isotropic etching (Anisotropic & Isotropic Etching) failure analysis applications of plasma material modification plasma blunt?????? layer corrosion? plasma etching polyimide? plasma to promote adhesion? biomedical applications? plasma polymerization reaction? plasma cleaning cylindrical mixing desk reactive ion etching (RIE) system specifications cylindrical Desktop reactive ion etching (RIE ) system, its highly versatile design, is an important factor in its great success. Characteristic cylindrical Desktop reactive ion etching (RIE) system includes a small installation area size, desktop reactive ion etching (RIE) system easy to install and meet a variety of vacuum plasma treatment processes modular design and multi-cabin RF types of electrode configurations. Furthermore the operating frequency of the RF power, process controllers, process gases and vacuum control system can be optional. Platform-based system platform basis cylindrical Desktop reactive ion etching (RIE) system of universal cylindrical Desktop reactive ion etching (RIE) system contains all necessary valves, vacuum line, RF power, RF and power supply unit process gas control and system logic to provide a fully automated cylindrical Desktop reactive ion etching (RIE) system. Cylindrical base platform desktop reactive ion etching (RIE) system can accommodate a variety of modular vacuum chamber and the RF electrode is inserted into the base system unit into. Cylindrical Desktop reactive ion etching (RIE) system can be converted from general cylindrical Desktop reactive ion cleaning system into a cylindrical type Desktop reactive ion etching (RIE) system or a desktop flat cylindrical electrode system in minutes . The modular vacuum chamber and RF electrode configuration modular vacuum chamber and RF electrode assembly cylindrical Desktop reactive ion etching (RIE) system is the cylindrical desktop reactive ion etching of the most unique design features (RIE) system. Money vacuum chamber material can be aluminum, anodized aluminum and stainless steel. Desktop cylindrical reactive ion etching (RIE) system vacuum chamber can be easily converted from one exchange to another. Composition vacuum processing tanks include several different RF electrode design, including water cooling [temperature control] and reactive ion etching (RIE) system of parallel RF electrode plates, alternating tray RF electrodes for plasma surface cleaning or processing for normal to minimize ion damage downstream electrode and the cylindrical cage (cage) electrodes. Cylindrical Desktop reactive ion etching (RIE) system of RF power cylindrical Desktop reactive ion etching (RIE) system has two optional frequency plasma process ie 30 kHz and 13.56 MHz RF power RF power. Each has a unique radio frequency processing feature that allows the user to select the most appropriate frequency to meet specific requirements. Available RF power range from 150 watts to 1250 watts. Automatic or manual matching network, provided when necessary. Desktop cylindrical reactive ion etching (RIE) system vacuum processing system according to the desired vacuum level requirements, desktop cylindrical reactive ion etching (RIE) system provides a mechanical pump and blower machinery vacuum. These pumps are available in corrosive gases such as oxygen or corrosive chemical applications. Downstream pressure control and mass flow control can be independently controlled vacuum and process gas flow. Cylindrical Desktop reactive ion etching (RIE) system, computer control system embedded computer keyboard and display provides a complete desktop automation cylindrical reactive ion etching (RIE) system. Unlimited plasma process with multi-stage storage processing step. Cylindrical Desktop reactive ion etching (RIE) system provides a display of all operating parameters, the user can be easily programmed. Cylindrical Desktop reactive ion etching (RIE) system size reactive ion etching (RIE) system: Width 62x height 63.5x 40 centimeters deep reactive ion etching (RIE) system weight: about 45 kg cylindrical reactive ion engraved desktop etching (RIE) system electromechanical information cylindrical Desktop reactive ion etching (RIE) system: 220V AC, 50Hz, 7A H20 for RF electrode cooling (due to different RF electrodes varies] air solenoid valve operation for N2 Plasma vacuum gas tank relief process gas if you TUNGROMA cylindrical Desktop reactive ion etching (RIE) are interested in the system, please contact us for more detailed information Rome Technology (Beijing) Co., Ltd. (Materials Science Department) Tel:! 010 5,713,007,313,910,046,648 Fax: 010-58144085 QQ: 70609221 E-mail: sale@tungroma.com Website: www.tungroma.com