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Wafer surface analysis and detection measuring system, the wafer surface tension analysis system

Wafer surface analysis and detection measuring system, the wafer surface tension analysis system
Wafer surface analysis and detection measuring system, the wafer surface tension analysis system
Wafer surface analysis and detection measuring system, the wafer surface tension analysis system

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Company:Rome Technology (Beijing) Co., Ltd.
Information Name: Wafer surface analysis and detection measuring system, the wafer surface tension analysis system
Update Time:2015-04-30
Validity:99999
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Price Description: RMB/
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Video Imaging (VCA-Wafer) wafer surface analysis and detection measurement system, the wafer surface tension analysis systems Details: Haupt TM Series video imaging (VCA-Wafer) wafer surface analysis and detection measurement system, the wafer surface tension analysis system is suitable Quality control of the semiconductor wafer (Wafer) technology. The video imaging (VCA-Wafer) wafer surface analysis and detection measurement system, the wafer surface tension analysis system provides wafer (Wafers) fast and accurate contact angle / surface energy of the surface analysis to evaluate the viscosity, cleanliness and coating. Haupt TM Series video imaging (VCA-Wafer) wafer surface analysis and detection measurement system, the wafer surface tension analysis system uses a lightweight design, easy assembly and based on the latest Windows? Standard user-friendly software to create a That is the precise contents of the contact angle measurement system and easy to use. Video Imaging (VCA-Wafer) wafer surface analysis and detection measurement system, injecting the wafer surface tension analysis system drip mechanism can lift for easy loading, eliminating damage to the wafer (Wafers) may arise. Video Imaging (VCA-Wafer) wafer surface analysis and detection measurement system, the wafer surface tension analysis systems for wafer surface analysis, but also can be used in other applications require measurement and analysis of large volume samples. Sample maximum allowable 300 X 300 X 19mm. ? Haupt TM series of video imaging (VCA-Wafer) wafer surface analysis and detection measurement system, the wafer surface tension analysis system applications (including but not limited to):?? Surface coating HMDS assessment process; surface contamination detection; ? coating quality assessment;;? glue & primer preparation;? coating uniformity test? surface cleanliness testing;? Research adhesion, wetting characteristics, bonding quality, surface treatment and fiber, fabric, polymer , semiconductor chips, hard drives, flat panel displays and biological materials, surface coatings. ? Absorption. Haupt TM Series video imaging (VCA-Wafer) wafer surface analysis and detection measurement system, the wafer surface tension analysis system uses a high-precision camera lenses and advanced PC technology to capture drops of static or dynamic images and determine a base tangent antennae measurements. Manual or automatic injector testing liquid provides easy dispensing mode. Computerized operation eliminates human error to draw lines and moving image capture time-sensitive analysis. Data and images stored in the computer for later analysis, and easily transferred to other applications. Video Imaging (VCA-Wafer) wafer surface analysis and detection measurement system, the wafer surface tension analysis system Main technical specifications; basic system;? Video imaging (VCA-Wafer) wafer surface analysis and detection measurement system, the wafer surface tension analysis system is a contact angle measurement system manually, measurable wafer (Wafers) maximum size of 300mm. Moving image capture rate of 60 frames / sec, the video image (VCA-Wafer) detecting wafer surface analysis measurement system, the wafer surface tension analysis system includes in addition to the surface energy analysis, the system also enables analysis of the surface tension of drops . The contact angle measurement system is equipped with electric, programmable injection dispensing system. Video Imaging (VCA-Wafer) wafer surface analysis and detection measurement system, the wafer surface tension analysis system can also be operated in a clean room use. ? High-resolution camera system, a magnifying lens, high-density LED light source for precision image capture? 300mm rotating work platform that allows detection of the wafer in all directions? High with PC control system, equipped with high-performance graphics for advanced image analysis and video Capture high-definition flat-panel display for displaying the image output video imaging (VCA-Wafer) wafer surface analysis and detection measurement system, the wafer surface tension analysis system software basic features;??? contact angle imaging and automated calculation of dynamic dropping capture (Watch the video mode to drip) surface energy (dyne / cm) surface analysis of statistical process control analysis hanging drop method function SE-2500 surface energy (dyne / cm) package;??? different liquids based on the same substrate The contact angle, the calculation of the substrate surface energy (dyne / cm), a list of the contact angle of various liquids on the same substrate. And with one of the four user selectable way to automatically calculate the surface energy, namely Zisman method (Zisman), the geometric mean method (Geometric Mean,), harmonic mean method (Harmonic Mean,), acid method ( Acid-Base). Image analysis workstation (IAW); specially equipped PC format for image analysis. Dynamic-2500 software;? Easy to use Windows-based operating systems, enhanced versatility and ease of interface to other programs;? Image capture capability intervals provide image capture and analysis, based on a user-defined time interval event analysis;? Multiple Image colleagues browsing;? image scroll & stacking capabilities;? high-speed image capture up to 60 images / second; AutoFAST imaging software; automatic gradation analysis imaging system captures an image and automatically calculates the actual droplet contact angle, without the need for manual intervention . The contact angle tangent and computer-generated teardrop-shaped curve fitting simultaneously displayed on the video image for easy viewing and analysis. PDAST (drip surface tension analysis) software; take dropping image analysis method, digital imaging and digital video curve fitting, using capillary Laplace equation to determine the surface tension (or interfacial tension). Microinjector - three micro-syringe needle - five sets of SPC (Statistical Process Control) software; an easy to use chart automatically record the contact angle, the height of the droplets, width, volume and area. Instantly displays statistics mean and standard deviation, as data input. All data can be printed, saved and / or out further analysis or imaging software programs among other. DataView software; visit the contact angle, width and height, area and volume of wet color chart. Data and charts can store, print and edit. Power injector assembly; computer-controlled automatic drip distribution system for a standard syringe. Providing repeatable user-defined liquid volume distribution. Video Imaging (VCA-Wafer) wafer surface analysis and detection measurement system, the wafer surface tension analysis system wafer (Wafer) sample work platform; circular platform sample size:?? Diameter of 12 inches (304.80 mm); admissible detecting wafer size: 4 inches, 6 inches, 8 inches and 12 inches; the optical axis:? 6 inches manual sliding latches; perpendicular to the optical axis motion:? 6 inches toggle; vertical movement distance:? 2 inches fluctuations ?; work platform rotation angle: 360 degree rotation, planetary bearing support for manual rotation; calibrate the monitor's power grid 220VAC Service:? video imaging (VCA-Wafer) wafer surface analysis and detection measurement system, the wafer surface tension analysis systems arrive After the office, product engineers to complete the free on-site guidance equipment installation and commissioning;? equipment warranty period of two years; if the video image (VCA-Wafer) interested in detecting wafer surface analysis measurement systems, please ask us for more details. Rome Technology (Beijing) Co., Ltd. (Materials Science Department) Tel: 010-57130073 13910046648 Fax: 010-58144085 QQ: 70609221 E-mail: sale@tungroma.com Website: www.tungroma.com microblogging: http: // weibo.com/733085677 
Contact Detail
Company Name: Rome Technology (Beijing) Co., Ltd.
Employee Number:
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Year Established:
Contact Person: Mr. Han Lei(Sales Manager)
Telephone Number: 010-57130073
Company Address: Block 22 East Third Ring Road, Chaoyang District Hujialou Zijinghaoting B, Chaoyang City, Beijing, China
Zip/Postal Code: 100035
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