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PS series cylindrical plasma reactive ion etching RIE / etch / strip / Plasma Lithography ..

PS series cylindrical plasma reactive ion etching RIE / etch / strip / Plasma Lithography ..
PS series cylindrical plasma reactive ion etching RIE / etch / strip / Plasma Lithography ..
PS series cylindrical plasma reactive ion etching RIE / etch / strip / Plasma Lithography ..

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Company:Rome Technology (Beijing) Co., Ltd.
Information Name: PS series cylindrical plasma reactive ion etching RIE / etch / strip / Plasma Lithography ..
Update Time:2015-04-30
Validity:99999
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Price Description: RMB/
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Products: PS series cylindrical plasma processing system a unique modular design of cylindrical plasma processing system PS series cylindrical plasma processing system redefines the cylindrical plasma treatment process. The plasma processing system based on a modular design and manufacturing, the use of a universal vacuum treatment cabin and chassis, a variety of electrode module easy assembly and configuration of the overall system. PS series cylindrical plasma processing system gives the user easy to operate, offers a variety of plasma processing technology, easy maintenance and cost-effective system than the industry more competitive gas plasma processing systems. ? Variety of interchangeable electrode module electrode configurations:?? Cylindrical cage (cage) electrode tray (tray) electrode, reactive ion etching (RIE) electrode, downstream of formula (Downstream) electrode industry-proven technology program / Menu? The industry recognized quality parts? endpoint detection (End-Point Detection option)? automatic RF matching device? downstream pressure control (optional)? computer control? touch screen? Variety vacuum pumping system optional cylindrical plasma treatment R & D System description plasma treatment process requires versatile and reliable equipment. In order to meet the ever-changing demands of plasma research, systems users to buy equipment to meet the widest range of plasma process parameters necessary process validation requires extremely high repeatability must facilitate the transformation for a new plasma process needs. PS is a satisfied plasma ashing, remove scum, isotropic and isotropic etching, ashing organic hybrid circuit cleaning, printed circuit board (PCB) decontamination, failure analysis, surface treatment and plastic parts modified Research polymer deposition, etc. Other applications of plasma, plasma system tools process development and small batch production for maximum eight-inch substrates precision plasma etching and deposition. The plasma processing system can accommodate multiple wafers. PS series cylindrical plasma processing system provides cylindrical plasma system unique modular design. PS series cylindrical plasma processing systems can accommodate treatment maximum 200mm or smaller substrate (single crystal wafer reactive ion etching (RIE) process, 300mm wafers can be processed). The system is built using high quality components approved, modular assembly, multifunction vacuum pods - electrode design, compact, automation and field-proven technology program enables PS plasma processing system has become the preferred process engineer equipment dry. Electromechanical PS series cylindrical vacuum plasma processing system applications PS series cylindrical plasma processing system configured with the pole so that the system can meet a wide range of plasma process processing requirements. The plasma process include simple surface cleaning to complex sub-nanometer reactive ion etching (RIE) etching; close collaboration group with a large customer base, we have developed a field-proven technology program to ensure that the system meets user needs. System equipment are used for manufacturing the highest quality components to ensure that our systems provide the highest possible uptime, reliability, repeatability and durability. PS series cylindrical plasma processing systems typically include a plasma treatment process? Plasma descum (Plasma Descuming)? Photoresist ashing (Photoresist Stripping)? Plasma surface treatment (Surface Treatment)? Plasma isotropic and isotropic Etching (Anisotropic & Isotropic Etching)? Fault Analysis (Failure Analysis Applications)? Material Modification (Material Modification)? package cleaning (Package Cleaning)? passivation layer etching (Passivation Etching)? etched polyimide (Polyimide Etching)? promote adhesion (Adhesion Promotion)? biomedical applications (Biomedical Applications)? plasma polymerization (Polymerizaton)? Mixed cleaning (Hybrid Cleaning)? pre-bonding cleaning (Pre-Bond Cleaning) PS series cylindrical plasma treatment System greatest success stems from its versatile modular design. These features include the use of a very small area of ??the table, or laminar flow installation and modular vacuum chamber and electrode configurations to meet a wide range of plasma process processing needs. In addition, the touch-screen computer control system provides a simple and multi-level program / menu control, system operation and control components. A variety of optional vacuum pump system. Universal Chassis PS series cylindrical plasma processing system The basic system PS series cylindrical plasma processing system include all necessary solenoid valves, vacuum pump, radio frequency (RF) power supply, radio frequency (RF) matching, a process gas control and system logic. These configurations provide a fully automated plasma processing system. Universal cabinet can accommodate different vacuum processing chamber, the electrode module; for easy implantation into the cabinet. Within minutes, the system can be turned into a reactive ion etching (RIE) system, flat electrode processing system, or mixed with bracket plasma cleaning system from an ordinary tumble plasma processing system. The modular vacuum chamber and electrode assembly PS series cylindrical plasma processing system vacuum chamber / electrode PS series cylindrical plasma processing system, which is the highlight of the system. Vacuum chamber with a hard anodized aluminum construction. Several different electrode design for matching, including surface cleaning, water-cooled (temperature control) plate electrodes for reactive ion etching (RIE) and the flat-panel plasma process, replace the tray (tray electrodes) Electrode or process, the downstream electrode (downstream electrodes) for reducing ion damage, cylindrical cage (cage electrodes) electrode uses ordinary tumble plasma treatment. PS series cylindrical plasma processing systems, plasma power supply PS series cylindrical plasma processing system using a 600W@13.56 MHz radio frequency (RF) power supply, equipped with automatic matching Network. Plasma Process cylindrical vacuum pumping system with a mechanical pump according to the user's level of vacuum plasma technology needs, systems, mechanical pumps and turbo molecular pump or Roots blower with a mechanical pump. It can also be equipped with different sizes of vacuum pump depending on the required level of vacuum processing. Filled with an inert vacuum pump to pump oil for oxygen or corrosive chemical gas applications. Two mass flow controller (MFC) control gas supply line comes standard with up to two-way. Downstream pressure control is optional. PS series cylindrical plasma processing system of computer-controlled computer PS series cylindrical plasma processing system touch screen controls provide wireless program / menu memory. Multi-step process is simple and easy to store. Conditions of continuous real-time display. The control system programming advice and having the process protection. Process can be in the form of a bar code (optional). PS series cylindrical plasma processing system optional Process option enables numerous PS series cylindrical plasma processing system with a more powerful processing capability. PS series cylindrical plasma processing system size cylindrical plasma processing system host: 89 cm wide x 81 cm deep x 53 cm high vacuum treatment tanks (internal) Width 14.75 "x Depth 17" x Height 12 "PS series of cylindrical Plasma Processing System Weight: 70 kg PS series cylindrical plasma processing system installation conditions cylindrical plasma processing system host 220 V 50/60 Hz, 15 Amps cylindrical plasma processing system 220 V H2O vacuum pump cooling air electrode for use to drive the solenoid valve operation for vacuum tanks with nitrogen N2 relief process gas N2. Ar, O2 if you are interested in TUNGROMA cylindrical plasma processing system, please contact us for more detailed information! Rome Technology (Beijing) Co., Ltd. ( Materials Science Department) Tel: 010-57130073 13910046648 Fax: 010-58144085 QQ: 70609221 E-mail: sale@tungroma.com Website: www.tungroma.com 
Contact Detail
Company Name: Rome Technology (Beijing) Co., Ltd.
Employee Number:
Annual export:
Year Established:
Contact Person: Mr. Han Lei(Sales Manager)
Telephone Number: 010-57130073
Company Address: Block 22 East Third Ring Road, Chaoyang District Hujialou Zijinghaoting B, Chaoyang City, Beijing, China
Zip/Postal Code: 100035
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