Ion etching machine / multi-hull plasma enhanced chemical vapor deposition / etch processing system ..

Products: Multi-hull plasma enhanced chemical vapor deposition (PEVCD) / Etching (ETCH) system, IL-50 多 pods formula PEVCD / ETCH system IL-50 多 pods plasma enhanced chemical vapor deposition (PEVCD) / etching ( ETCH) system has the ability to deposit a thin film photovoltaic cell, providing precision coating performance. Without breaking vacuum, can the maximum deposition of four films. ?? Multi-cavity and other load interlocking (Load Lock) wafer plasma system to the wafer feed cassette cartridge (Cassette-Cassette processing) plasma treatment when breaking vacuum deposition up to four film substrate size??: 125 x 125mm, 156 x 156mm and 200mm diameter substrate (loader can handle small-sized substrate) conventional thin film:.?? SiOx & SiNx - a- Si development, trial production and manufacturing reactive ion etching (RIE? ) for the optional vacuum processing tank? full computer control system? The modular design of vacuum treatment tanks, and connected with the 200mm gap valve. Multi-hull plasma enhanced chemical vapor deposition (PEVCD) / Etching (ETCH) system described IL-50 多 pods plasma enhanced chemical vapor deposition (PEVCD) / Etching (ETCH) system consists of a central control module, built robotic vacuum chamber . Multi-cavity module including a central vacuum chamber, a wafer handling robot, Process four cabin structure, each interface with the gate. Central vacuum chamber configured a vacuum connection and vacuum gauge. Can install up to four sets of plasma enhanced chemical vapor deposition (PEVCD) or reactive ion etching (RIE) Process vacuum chamber in the central control module. These wide-angle valve vacuum treatment pods isolation. Plasma enhanced chemical vapor deposition (PEVCD) or reactive ion etching (RIE) Process vacuum chamber designed and manufactured for specific applications, and each cabin is equipped with a separate vacuum pump systems, process gas control, heating / cooling systems, pressure The system processes the gas nozzle and other specific process required configuration. Wafer to wafer feed cassette cartridge module for wafer loading and unloading import export. Module operates in a vacuum environment, through isolation valve and system control module. A single system can integrate up to two wafer to wafer feed cassette cartridge module. IL-50 多 pods plasma enhanced chemical vapor deposition (PEVCD) / Etching (ETCH) System IL-50 多 pods plasma enhanced chemical vapor deposition (PEVCD) / Etching (ETCH) systems for solar wafers Coating deposition or etching on film. Single or multiple layers can be processed. Pre-etched features are also available. Up to twelve wafers can be loaded with imported transferred wafer pod, the pod and placed the wafer transfer module. Wafers by robot goes to the processing modules to a particular process, thin film deposition or etching. After film deposition or etching process is completed, the wafer moved to another tank for further processing or import wafers cartridge loading / unloading module. IL-50 多 pods plasma enhanced chemical vapor deposition (PEVCD) / Etching (ETCH) System Specifications IL-50 多 pods plasma enhanced chemical vapor deposition (PEVCD) / Etching (ETCH) system includes up to four treatment cabins A wafer transfer cabin and a loading / unloading platform IL-50 多 pods plasma enhanced chemical vapor deposition (PEVCD) / Etching (ETCH) wafer transfer system cabin IL-50 多 pods plasma enhanced chemical vapor Deposition (PEVCD) wafer transfer chamber / etch (ETCH) system consists of high-quality aluminum construction, with four processing tanks and wafers cartridge loading / unloading 200mm Interface Platform. Articulated link robots for wafer processing system from import wafer cartridge, and then into the processing tank, and finally returned. IL-50 多 pods plasma enhanced chemical vapor deposition (PEVCD) / Etching (ETCH) system pod transport platform Wafer IL-50 多 pods plasma enhanced chemical vapor deposition (PEVCD) / Etching (ETCH) system is equipped with a wafer pod delivery platform. The platform is made of aluminum alloy construction. Metal material wafer cartridge loading platform, and then import the wafer transfer compartment. IL-50 多 pods plasma enhanced chemical vapor deposition process chamber (PEVCD) / Etching (ETCH) system, IL-50 多 pods plasma enhanced chemical vapor deposition (PEVCD) / Etching (ETCH) Processing System modular cabin design, and is connected to the wafer transfer module via a 200mm gate. The process tank made of aluminum alloy, including heating / cooling units, through a special process kit through the line temperature control. Independent vacuum gauge, each cabin is equipped with gas control system. Processing cabin by plate electrode design. The upper electrode with process gas nozzles, for a uniform process gas intervention. IL-50 多 pods plasma enhanced chemical vapor deposition (PEVCD) / Etching (ETCH) system, plasma power each independent processing compartments with separate 1200W@13.56MHz RF power. Each process chamber is equipped with strong coupling RF matching network. IL-50 多 pods plasma enhanced chemical vapor deposition (PEVCD) / Etching (ETCH) System Process vacuum pumping system, depending on the treatment process needs, different vacuum pump system can be on-demand, including mechanical vacuum pump vacuum pumps, dry vacuum pumps, vacuum pumps and turbo blower kit. Each treatment chamber has an independent vacuum pump set, and the wafer transfer chamber using another separate vacuum pump system. IL-50 多 pods plasma enhanced chemical vapor deposition (PEVCD) / Etching (ETCH) system, computer control system controls the entire system uses advanced control systems, use the pull-down menu format, dedicated program. These programs provide a multi-step menu setting, controlled through the whole process sequence. Process steps can also be stored for later use. The operating system provides an integral process control. If you are interested in more pods TUNGROMA formula PEVCD / ETCH system, please contact us for more detailed information! Rome Technology (Beijing) Co., Ltd. (Materials Science Department) Tel: 010-57130073 13910046648 Fax: 010-58144085 QQ: 70609221 E-mail: sale@tungroma.com Website: www.tungroma.com