PALOMAR9000 automatic wedge bonder

PALOMAR 9000 automatic wedge bonder wedge bonder 9000 can be used in high-speed line / with wedge bonding, with a large area of ??the working area, the flexibility of the feed line to change the angle of 45-60 ° or 90 ° into deep cavity. Accuracy * 1μm, 3σ, repeatability * High-precision touch off, no time delay * Precise control key force (1 CN) intelligent interactive graphical interface (i2GI) * by program tree display (PTD), video graphics display (VGD) , human-machine interface (MMI) and parts graphic display (PGD) for interactive wedge control * Cognex 8500 series provides real-time video image processing engine * by side rotatable camera in real-time throughout the observation wire arc process control and hierarchical tree * 2D graphics view control * Setup Wizard simplifies the calibration, setup and programming process * Microsoft Windows 7 software platform large working area * 12 "x 6" (305mm x 150mm) Speed ??* 6 lines / sec * 10 wire arc / sec process benefits * line arc span: 70μm to 20mm * arc can form various forms of line * Highly standardized and consistent line length * highly regulated and consistent line arc height * single wire arc-like quality control * Real-time monitoring and bonding process control software * The strong, low maintenance voice coil bonding head high productivity * continuous bonding techniques (CBT) * 2 or more small area table, a small size device can efficiently handle or the substrate, positioning time can be reduced to increase product yield or the substrate, eliminate indexing time, so that the production capacity to maximize production and assembly automation * Multiple loading and unloading options to achieve a complete production line assembly station * Configurable non-heating and heating work BOND DATA MINER - perfect centralized data management and analysis of operational data integration system * and timestamp data analysis process tool set * * Monitor machine and process trends, improve the yield and predictive maintenance Application examples * Module * hard * complex hybrid module * radiofrequency (RF) and microwave modules * COB technology (chip pasted directly into PCB board) * High-density hybrid modules * fine pins on the device mount * high frequency passive and active components * MCM power connector * chip to chip * continuous welding with welding performance and specifications production capacity: 6 lines / sec, Line 10 arc / sec Repeatability: 1μm, 3σ diameter range (Gold & Aluminum): 17.5μm - 75μm (0.7mil - 3mil) gold with specifications: 12.7μm x 50.8μm, up to 25.4μm x 254μm (0.5mil x 2mil up to 1mil x10mil) bonded to the work area: 305mm x 150mm (12 "x 6") Z-axis travel: 25.4mm (1.00 ") (20.32mm coarse; 5.08mm fine) wire arc: 70μm to 20mm, diversification wire arc, the standard line arc, arc length fixed line, fixed line arc height, high-speed, long lines arc. Chain-shaped bonding: collar key legal drive system: the industry's leading control system and the motor / amplifier Encoder Image Recognition: Cognex 8500 image processing engine coupled with GigE digital cameras and red / green / blue LED lighting autofocus Elevation Updated Software: Multi-user security permissions hardware and installation conditions Power: 230VAC +/- 10% (207-253), 15 A 50 / 60Hz, 1 PH, NEMA L6-20P PLUG ON CORD inlet pressure: CDA (Bonder) - 414 kPa @ 25 m ^ 3 / hr (60PSIG @ 15SCFM) Volume: 1778mm x 800mm x 953mm (70 "H x 31.5" W x37.5 "D) Vacuum: VAC (Stage) - 85 kPa (25 in Hg), 6.35 mm (0.25 ") OD plastic tube diameter weight (net): 1400 kg (3100 lbs) Floor requirements: a concrete floor, a thickness of at least 102 mm (4.0")