TPT semi-automatic wire bonders

TPT semi-automatic wire bonder Product Overview TPT is a German company, headquartered in Munich, the high-tech area. Based on 20 years of expertise, TPT has designed and manufactured a comprehensive range of manual and semi-automatic wire bonding equipment; its HB05 / 10/16 is the ball bonding and wedge bonding on the same piece of equipment bonding station. TPT equipment installed throughout the world, suitable for field schools, research institutes, semiconductor manufacturing, aerospace, and medical devices unit. Product Features 1. 6.5 "touch-screen control 2. Easy solder ball bonding and wedge bonding switched automatically adjust the height 3. 4. 5. Electronic deep cavity bonding clip - precise tail wire length control 6. gold bumps bumping function 7. The electric feed line 8. 9. chip pick and place tools welding head positioning system 10. The auxiliary arc simple programming control line 11. repeatable linear control parameters TPT Bonder application gold / aluminum wire wedge bonding 17-75μ, gold / aluminum wedge maximum 25 × 250μ, gold ball bonding and gold bumps 17-50μ models: manual wire bonders, semi-automatic bonder 1. Manual Bonder (HB05) HB05- wedge & ball bonding 2. Semi-automatic machine machine, Z-axis motor drive (HB10) HB10- ball / wedge welder 3. semi-automatic machine, Y & Z-axis motor drive (HB16) HB16- ball / wedge welder 4. coarse wire bonder, Y & Z-axis motor Driver (HB30) HB30 thick wire bonder