8000 Automatic multi-function bonder

PALOMAR 8000 automatic wire bonder multifunction machine Wire Bonder high reliability solder bumping and wire bonder 8000 bonder Bonder Overview 8000 is a high speed automatic ultrasonic bonder, can be welded spherical crystal Round bumping, chip bumping, as well as customized line arc shape. As a first-level packaging method for interconnecting selected, it is suitable for assembly in many aspects and elements of the package, including complex hybrid circuits, MCMs and high reliability devices. PlanarBump patented technology uses gold to produce wireless tail bumping, also 8000 for flip-chip bonding machines and other advanced packaging applications. The overall accuracy of the depth capacity of 8,000 type bonder in its large working area and can be used inside, resulting in a high yield fine-pitch / high line count application process. 8000 8000 matching bonder bonder and bumping solder ball row configuration is a unique feature of this system. Bonder 8000 is the only system capable of generating step Co-planarized type gold ball available. This automatic thermal ultrasound, high-speed ball - and - two gold ball welding joints improves product yield, eliminating the source of your process change. Technical parameters: Bonding type: Hot ultrasonic gold ball bonding, wireless tail bumping Cycle time: 0.125 seconds / line 0.077 seconds / bump minimum line spacing: 50um (20um diameter of time) - Place Accuracy: ± 2.5um operating system: Windows NT computer: PentiumⅢ (or higher) processor wire range: 300mm × 150mm Resolution: 0.2um reusable degrees: ± 2.5um drive systems: a linear encoder motor, direct-drive visual system: Cognex 8000 Series vision system captures the range: 760um ~ 1300um angle range: ± 7 ° Focus range (focal depth): 10mm Programmable lighting: Dual LED Lighting spool diameter:. 50.8mm double edge spool reel length: 25.4mm ~ 50.8mm line Diameter: 17.7um ~ 50.8um ultrasonic generator: 1 watt or 5 watt selectable phase-locked frequency ultrasound generator: 60KHz or 120KHz ultrasonic modes: continuous voltage or continuous current power supply: 220 VAC, 30 A, vacuum degree: 25inHg (635mm Applications cameras and portable phones inside the camera sensor MEMS PDAs stacked memory device 1800lbs pounds (net) 816KG chip bumping paste: Hg) air / nitrogen pressure: 60 psi Volume: 31.5 "long x 70" high x 37.5 "deep Weight components such as DSPs, ASICs, SAW filters, high-brightness / high-power LED, CMOS image sensors other general applications in the automotive assembly COB CMOS camera module disk drive assembly displays and solar panels fine-pitch devices flexible circuit large, complex multi-mode hybrid circuit chip pieces (MCMs) Special Features 8000 framework SIPs bonder using a unique wire head movement (double Z- axis rotational movement of patented) function, by repeating the smooth top of the ball cut the lead to form a precise golden goal bumping, will not stay wired tail. This provides a consistent height of less than 20 microns bumping formation, which eliminates the need for secondary pressure ball technology. For 8000 bonder key software features include appropriate pad deformation , reinforcing wire arc mode, the wireless end bumping and simulation wedge welding (welding chain) .8000 type bonder capable of performing the process .SOS SOS is a user-defined priority in the crescent-dimensional bumping solder interface program .IC to I or welding difficult material will benefit from the outstanding performance characteristics of continuous welding technique - conducting wire while the device's ability to crawl on the bonders thereby eliminating operator stop bonding machine and stepper needs. .8000 type bonder highlight of this technology.