TPT semiautomatic bonder

TPT semi-automatic wire bonders HB05 wedge & Ball Bonder Bonder HB05 manual ultrasonic bonding machine for hot wedge & ball bonding HB05 is a desktop bonder, is the ideal equipment for laboratory and pilot production line. Slap only need to replace the knife, a bond head can be applied to the ball / wedge bonding mode. LCD display, easy to operate. All bonding parameters can directly enter and simple adjustment. Features + wedge, ball, bumps and bonding with lead + 17μm to 75μm and 25μm X 250μm line with + 4.3 "LCD display & multiple sets of keys + deep cavity bonding head up to 16mm + bonding arm length 165mm + motor drive the tail control + 20 program storage capacity specifications wedge bonding method - wedges, ball - wedge, with - & bump - key alloy wire diameter 17 - 75μm (0.7-3mil) aluminum wire diameter 17 - 75μm (0.7 -3mil) with size maximum 25x250μm (1x8mil) ultrasound system 62kHz ultrasonic sensor PLL control power 0 - 5 W output bonding time 0 - 1 second bonding force 5 - 130 cNm Slap 1.58 knife, length 19mm (0.0624 "x0.75") motor spools 50.8mm (2 ") break the bond head angle of 90 degrees off feed line clamp moving motor up / down to move the ball diameter electronic control seam welding depth 165mm (6.7") to fine-tune the platform to move 10mm (0.4 ") agencies than 6: 1 temperature controller up to 250 ℃ +/- 1 ℃ electricity demand 100-240V +/- 10%, 50 / 60Hz, 10A maximum dimensions 550x450x250mm Weight Net 25kg industry standard CE standard HB10 Wedge & Ball Bonder HB10 motor driven Z-axis thermal ultrasonic bonder for wedge & ball bonding HB10 is a desktop bonder is an ideal laboratory equipment, pilot or small production lines. Slap only need to replace the knife, a bond head can be applied to the ball / wedge or wedge / wedge bonding mode. The touch screen is easy to operate. All bonding parameters can directly enter and simple adjustment. Features: + wedge, ball, bumps and bonding with lead + 17μm to 75μm and 25μm X 250μm line with + 6.5 "LCD touch screen + deep cavity bonding head up to 16mm + bonding arm length of 165mm + 100 programs storage capacity + Z axis motor drive + USB backup + control + electronic sphere diameter lessons & placement options + option + copper tensile testing specifications bonding options bonding method wedge - wedge, the ball - wedge, with - & bump - key alloy wire diameter 17 - 75μm (0.7-3mil) aluminum wire diameter 17 - 75μm (0.7-3mil) with size maximum 25x250μm (1x8mil) ultrasound system 62kHz ultrasonic sensor PLL control power 0 - 5 W output bonding time 0 - 10 seconds bond Heli 5 - 150 cNm (350cNm optional) Slap knife 1.58, long 19mm (0.0624 "x0.75") motor-driven spools 50.8mm (2 ") break the bond head cut / clamp wire feed angle of 90 degrees off the clip move motor up / down to move the ball diameter electronic control of the motor-driven Z-axis travel 17mm (0.67 ") seam weld depth 165mm (6.7") to fine-tune the platform to move 10mm (0.4 ") mechanism than 6: 1 temperature controller up to 250 ℃ + / -1 ℃ electricity demand 100-240V +/- 10%, 50 / 60Hz, 10A maximum dimensions 680x640x490mm Weight Net 42kg industry standard CE standard HB16 Wedge Bonder & Ball Z & Y-axis motor drive HB16 ultrasonic bonding machine for hot wedge & ball bonding HB16 is a desktop bonder is an ideal laboratory equipment, pilot or small production lines. only need to replace Slap knife, a bond head can be applied to the ball / wedge or wedge / wedge bond combined mode with a touch screen is easy to operate. All bonding parameters can directly access and simple adjustment. Features + wedge, ball, bump and with bonding + 17μm to 75μm leads and 25μm X 250μm line with + 6.5 "LCD touch screen + deep cavity bonding head up to 16mm + bonding arm length 165mm + storage capacity 100 programs + Motor-driven Z & Y axis + wire arc editable + USB backup + electronic ball diameter control + lessons & placement options + tensile testing options + copper wire bonding option Technical Specifications wedge bonding method - wedges, ball - wedge, with - & bump - key alloy wire diameter 17 - 75μm (0.7-3mil) aluminum wire diameter 17 - 75μm (0.7-3mil) Maximum Size 25x250μm (1x8mil) ultrasound system 62kHz ultrasonic sensor PLL control power 0 - 5 W output bonding time 0 - 10 seconds bonding force 5 - 150 cNm (350cNm optional) Slap 1.58 knife, length 19mm (0.0624 "x0.75") motor drive spool 50.8mm (2 ") break the bond head cut / clamp wire feed angle of 90 degrees off the clip moving motor up / down to move the ball diameter electronic control of the motor drive Z-axis travel 17mm (0.67") Y-axis motor drive stroke 7mm (0.27 ") seam weld depth 165mm (6.7") to fine-tune the platform to move 10mm (0.4 ") mechanism than 6: 1 temperature controller up to 250 ℃ +/- 1 ℃ electricity demand 100-240V +/- 10%, 50 / 60Hz, 10A maximum dimensions 680x640x490mm Weight Net 42kg industry standard CE standard HB30 thick wire bonder motor driven Z & Y-axis coarse wire bonder HB30 HB30 is a desktop bonder, laboratory, pilot or pre-production commissioning, or ideal for small batch production line is easy to operate with a touch screen. All bonding parameters can directly enter and simple adjustment. Features + 100μm to 500μm aluminum + 6.5 "storage capacity LCD touch screen + 100 programs + built-in dual fiber optic lighting + Z axis motor drive bond head + Y-axis motor drive control for Back rad + ratio XY mechanism 6 : 1 + wire arc editable + + semi-automatic welding seam can, step by step and manual bonding mode Technical Specifications ultrasound system PLL US system ultrasonic power 50 W output bonding time 0 - 10 seconds bond force 50 - 1500 cN diameter aluminum wire 100 - 500μm break off the front line to send a 90 degree angle of the motor driving the Y-axis travel back up to 17mm motor-driven Z-axis travel 20mm 15mm trimming stage movement mechanism ratio 6: 1 (3: 1 optional) power requirements 100-240V +/- 10%, 50 / 60Hz, 10A maximum dimensions 680x640x490mm Weight Net 50kg industry standard CE standard