Thermal conductivity potting, high thermal conductivity encapsulants, potting power led Model

Thermal conductivity potting, high thermal conductivity encapsulants, potting power led Model Product Introduction Osborne 192 series is a low viscosity flame retardant two-component addition silicone thermal conductivity potting, room temperature curing can also It can heat curing, the higher the temperature the faster the cure characteristics. The goods in the curing reaction does not produce any by-products can be applied to the surface PC, ABS, PVC, etc. and metal class. Its flame retardant UL94-V0 level can be achieved. Full compliance with EU ROHS directive. Typical uses are widely used to heat, flame retardant, high temperature requirements for products such as: automotive electronics, HID, power modules, sensors, circuit boards, transformers, amplifiers. Use of technology 1, potting products need to be kept dry and clean. 2, before mixing, first A and B components in their respective container, stir. 3, the ratio by weight accurately weighed, after the required mixing ratio, stir to avoid incomplete cure. 4. In general, molded 20mm below natural defoamed can mold as a result of high temperature curing speed or molded depth is deep, it can be degassed as required. At this time in order to remove air bubbles molded surface and internally generated, the mixture should be placed in a vacuum container, degassing at 0.8MPa at least 5 minutes. Thermal conductivity potting, high thermal conductivity encapsulants, potting power led Model 5, above temperature shall be given in the technical parameters before and after curing, maintaining appropriate curing time, if the application is thicker, the curing time may It will be exceeded. Room temperature or heat curing can be. Adhesive curing speed affected curing temperature in winter need a long time to cure heating is recommended curing, cured 15 minutes at 80 ~ 100 ℃, room temperature curing normally takes about eight hours. 6, the curing process, please keep the environment clean and avoid impurities or dust falling into the uncured glue surface. Thermal conductivity potting, high thermal conductivity encapsulants, potting power led model Packing 20kg / set (A component B component 10kg + 10kg). Storage and transport a cool, dry place for storage, the storage period of 12 months (25 ℃ below). 2, the product is non-dangerous goods, according to general chemical transport, accidentally leaked during transport. 3, more than the shelf life of the product must be confirmed before use exception.