The silicone gel, electronic silicone gel, molding silicone gel encapsulants model

The silicone gel, electronic silicone gel, molding silicone gel encapsulants Model Product Introduction Osborne 196 is a low viscosity two-component addition silicone gel, room temperature curing can be cured by heating, The higher the temperature the faster the cure has characteristics. Features 1, after the semi-solidified glue curing, good adhesion to many substrates and sealing performance, have superior resistance to thermal alternating performance. 2, two-component mixture is not rapidly gel, which has a longer operating time, once the heat will quickly curing, curing time can be freely controlled. 3, the curing process generates no byproducts, no shrinkage. 4, has excellent electrical insulation properties and resistance to high temperature performance (-50 ℃ ~ 200 ℃). 5, the gel by external force cracking can automatically heal, also play a waterproof, moisture effect, does not affect the results. The silicone gel, electronic silicone gel, molding silicone gel encapsulants typical model widely used in precision electronic components, bathroom, backlight, solar, connectors, electronic modules waterproof, moisture, gas pollution coating, casting and potting protection.