Guangdong integrated circuit (IC) with microsilica where the good price

First, the integrated circuit (IC) with Silica Overview: Silica is a class of integrated circuits with extremely versatile inorganic non-metallic material with high whiteness, fine particle size distribution reasonable, large surface area, excellent suspension properties, purity high, excellent dielectric properties, low coefficient of thermal expansion, thermal conductivity advantages, widely used for insulation of high-grade coatings, paints, adhesives, silicone rubber, precision casting, ceramics and plastic materials integrated circuits and potting materials, high pressure cast components and so on. Second, our product specification sheet: an integrated circuit (IC) with a standard 400 mesh silica powder 600 mesh 800 mesh mesh 1250 1000 1500 4000 2000 mesh mesh mesh mesh 6000 mesh 8000 10,000 head three integrated circuit (IC) with microsilica Status : As the world's OEM manufacturing center gradually shift to China, together with the national recognition of the integrated circuit (IC) industry importance in recent years introduced a series of policies to promote the continuous development of IC, accelerated the Chinese IC design, development, processing, packaging the development of technology. An extensive range of signs that Japan, South Korea, Taiwan and other regions have begun large-scale enterprises to enter China, involved in the semiconductor packaging industry. This will directly boost domestic demand, the ball microsilica as a high value-added products on the market is quite broad. Fourth, the future prospects for the development of integrated circuits (IC) with Silica: micron integrated circuits by chemical synthesis spherical silica powder currently in the country is still blank, no patents and industrial products. Japan is also only a few foreign companies have the production capacity, due to the lack of Japanese silicon resources, so its spherical silica powder is expensive, lack of international competitiveness. The development of this product is market demand, to fill the gap, import substitution, to better promote the development of an epoxy seal material and IC industries. Silica is an important support for epoxy molding compound materials, epoxy molding compound is an important support for IC packaging materials, IC packaging industry is an important part of the IC industry, while sales packaging industry has accounted for sales of domestic IC industry about 70%. Thus, the development of IC Silica plays an important role. Integrated circuit (IC) with microsilica c