Guangdong spherical silica powder epoxy molding compound, where a good price

First, the epoxy molding compound with silica powder Overview: epoxy molding compound with Silica adoption rate of 95% or more spherical spherical high purity silica powder, insulating encapsulating material for epoxy resins, can greatly increase the amount of padding to reduce mixing viscosity of the material system, improving process performance, increase the ability to penetrate the mixture, expansion coefficient and reduced shrinkage during curing of the cured product, reducing the difference in thermal expansion. Second, our Product Specifications: Specifications epoxy molding compound with silica powder 400 mesh 600 mesh 800 mesh mesh 1250 1000 1500 4000 2000 mesh mesh mesh mesh 8000 6000 10,000 head three head, epoxy molding compound with Silica performance parameters: Product name Common mesh whiteness Mohs hardness performance characteristics of electronic grade and electrical grade epoxy molding compound with silica powder 7 degrees above 600-500090 spherical silica powder used in the epoxy resin insulation packaging materials, can greatly increase the filling amount , reduce the viscosity of the mixed material system, improve the processing properties, improved penetration mixture, reduce shrinkage and expansion coefficient of the cured product during curing, reducing the thermal expansion difference. Fourth, the epoxy molding compound with silica powder Features: 1, large specific surface area: non-porous surface, low water content; 2, purity: high-purity raw material and special treatment, low impurity ion content, low crystalline content; 3, spherical high: true spherical particles, particle size in the range of 30-2 m; 4, good dispersion: no surface adhesion force, the ball smooth, easy to disperse; 5, narrow particle size distribution and controlled: facilitate grading mixing processing;