Potting epoxy adhesive bonding

Potting epoxy adhesive bonding characteristics and main performance: The adhesive is room temperature curing, modified epoxy adhesive temperature -50-150 ℃, sub B component. Bonding process is simple, convenient, fast curing, 0-5 situation is curable. Good chemical resistance, oil, water, acid and alkali shear strength ≥14.7MPa peel strength ≥19.6N / cm. Solvent-free non-toxic, wet surface oil also can be bonded. Purpose: The adhesive can be used for metal, glass, ceramics, hard rubber, cement, plastic, wood or the same kind of bonding dissimilar materials. Excellent overall performance, widely used for bonding automobiles, aircraft, electronics, electrical, instrumentation, machinery, petroleum and other industries, sealing, casting, assembly, repair, coating and the like.