Temperature silver paste - lead-free SMT process precision welding material

Temperature lead-free solder paste by a low oxidation degree spherical solder powder and special solvent composition, the system uses the high performance thixotropic agent, has excellent solubility and printing continuity, specially designed to meet the no-clean after welding and soldering After the residue decomposition will not occur. It has a great range of selectable parameters, so that it can adapt to different environments, different equipment and different application processes. It ensures the continuity of the excellent printing, anti-collapse ability, surface insulation resistance performance. Lower after welding residues can guarantee by ICT tests. It has excellent anti-dry capability, under conditions of continuous printing paste still has 12 hours to ensure good adhesion. Feature? Lead-free solder 12 hours of continuous printing capacity 6 hours schedule is no need for air protection collapse viscosity remains constant over 16miI (0.4mm) after a simple wash away printability belong to clean solder paste solder. Usually without cleaning residue after soldering the application.