Lead solder - free solder paste - Shenzhen paste suppliers

Paste is a precision welding materials designed for today's SMT production process. Help paste using a special oxygen content is extremely low spherical solder powder made of thixotropic mixture, with excellent continuous printing performance. In addition, to help paste used in this product, the use of non-ionic surfactant system with high reliability, making it the residue after reflow very little and has a very high reliability. Another no-clean lead-free solder alloy composition may provide different, different tin powder particle size and metal content of different products to meet the requirements of customers of different products and different process. Second, product characteristics 1. Printing and rolling off the tin, and on the pad can also complete the fine print; 2. Continuous printing, the viscosity and adhesion changes little, long life, more than 12 hours is still not become dry, can maintain good printing results; 3. After printing a few hours remain the original shape, almost no collapse, no SMD components shift; 4. It has excellent welding performance, in different parts of the exhibit appropriate wettability; 5. Can be adapted to the requirements of different grades of welding equipment, no welding done under nitrogen environment, can adapt to a wide range of reflow oven temperature; 6. Very little residue after soldering, the color is very light and has a large insulation resistance, will not corrode the PCB, achieve disposable requirements; 7. ICT test has better performance, it does not produce false positives. Paste usually use the refrigerator, cold storage temperature 5 ~ 10 ℃ better. When removing the paste from the refrigerator prior approval of the "hung" in order to open the bottle use.