SMT low temperature solder paste - electronic chip high-precision welding solder paste

Low temperature solder paste is modern SMD precision welding process the most widely used a welding material, welding a metal powder and a paste made of special solvent, widely used in precision SMT chip technology with ultra-long continuous weld printing performance. 12 hours of continuous printing viscosity remains constant over, solder joints, tin climb well, a variety of cold solder paste printing section in line with modern technology with good environmental resistance, and can pass the test to ensure that ICT in patch welding process It has a very good performance and excellent anti-collapse of continuous printing capability, without cleaning after welding. Characteristics of melting point 138 ℃ has a great range of technology selectively excellent continuous printing performance bright spot full uniform paste long life, viscosity remains constant no cleaning after soldering lead-free solder residue storage conditions: 5-10 ℃ environment Under the storage period of six months, should not be less than 0 ℃ under the conditions of storage prior to use solder paste process need to be warmed to thaw at room temperature for 3-4 hours is recommended, followed by stirring for 1-2 minutes full uniform before use. It is sealed to prevent moisture produce tin solder is not required when using.