Bao'an District, Shenzhen PCB PCBA board welding processing incoming

Sky, Shenzhen Electronics Co., Ltd. to provide professional PCB BGA soldering and welding processing services, the use of machines and hand-matching operation, manual printing, patch, plug-ins, lead-free automatic reflow soldering for many famous domestic enterprises to provide a high quality processing services and constantly adding new user groups, providing production, placement, instrumentation, welding, repair, assembly, testing, inspection, packaging and shipping services to the whole process, through our unremitting efforts, with a patch line and the plug-in line, lead-free reflow soldering equipment, ovens, lead-free solder dip furnace, demolition welding rework station, ultrasound and other equipment to meet the minimum 0201 package components, original equipment manufacturers with a common optimize product design and production, enthusiasm and hope that your sincere cooperation, create brilliant. 
 Services: 
 1. To undertake various research and development model proofing welding, portable panels, and advanced welding, welding of high-tech products, circuit boards, PCBA welding processing services. Same-day} {fastest 
 Bumping, BGA rework, BGA posts installed, BGA soldering, BGA than plastic, BGA Repair, BGA fly line (unlimited number, quantity favorably). 
 3. Circuit board dismantled, PCB board Removable components, the old circuit boards for various components of material removal, classification, the whole foot, dragging tin, testing, processing, use of reflow temperature demolition, security chip, the failure rate. 
 4. Professional production of precision BGA chip test stand (minimum distance of up to 0.4 mm) double precision testing of imported needle and anti-static materials, access to reliable, accurate positioning and long life. (Valet chip batch testing) 
 Chip processing LGA, BGA, QFN, CSP, QFP, 0402 and so, MI hand into processing (DIP) hand post with lead free reflow soldering, only small quantities for film post production and processing plug-ins. 
 6. Electronic assembly, machine assembly, electronic components, rework, assembly of electronic products, electronic products (PCBA) batch testing and maintenance. 
 7. Exclusive design of remedial measures, can be more than 0.3mm spacing on the BGA, CSP, QFP and other packages for fly line array remedial welding repairs.