Lead-free solder paste supply of disposable

Lead-free products are the vanguard of green countries in the world dedicated to research and development of lead-free solder, lead-free out of our R & D type solder paste no-clean, stable performance, adhesion, moderate, continuous printing of the good, less residue after soldering, welding high strength, without washing. 
 Features: 
 ● good wetting, anti-open bottle after use up to 48 hours of dry time, more effective quality assurance paste; 
 ● Printing and good rolling and Stripping on the pad pitch 0.3mm above the PCB board can better printing, continuous printing when the viscosity changes very little, no small ball and collapsed, chip components will not shift ; 
 ● solder joint formation, full, bright, uniform, permanent as new; 
 ● minimal residue after soldering, and is colorless and transparent, with a larger surface insulation resistance, will not corrode PCB, can be achieved disposable requirements. 
 Technical parameters: 
 A. Preheat: Maximum temperature: 1.0 ~ 3.0 ℃ / sec 
 B. Immersion Area: Temperature: 130 ~ 170 ℃ Time: 60 ~ 90 seconds 
 C. Back to the welding area: maximum temperature: 235 ~ 249 ℃? Time: 217 ℃ 60 ~ 90 seconds or more 
 D. cooling zones: the temperature drop: <4 ℃ / sec 
 Note: The above curve for test, set to be combined with the actual nature of the product, component distribution, equipment, conditions and other factors considered.