Supply lead-free solder paste

This is a no-clean flux paste homogeneous powder mixture of harmony, with moderate viscosity, good thixotropy, prevents solder paste deposit process does not appear in the settlement, the flux contains a number of additives, making the solder paste does not appear in the reflow process of injection. Particular the use of a high softening point and acid value of the synthetic resin and a non-ionic halogen activator system, making the solder paste after reflow does not corrode the components, and very little solid residue. 
 Features: 
 ● good wetting, anti-open bottle after use up to 48 hours of dry time, more effective quality assurance paste; 
 ● Printing and good rolling and Stripping on the pad pitch 0.3mm above the PCB board can better printing, continuous printing when the viscosity changes very little, no small ball and collapsed, chip components will not shift ; 
 ● solder joint formation, full, bright, uniform, permanent as new; 
 ● minimal residue after soldering, and is colorless and transparent, with a larger surface insulation resistance, will not corrode PCB, can be achieved disposable requirements.