2013--2018 global and domestic investment in the development of integrated circuit packaging industry research report

2013--2018 global and domestic investment in the development of integrated circuit packaging industry research report ----------------------------------- ---------------------------------〗 〖Report No. 72187〗 〖completion date of September 2013 〖delivery〗 EMIL electronic version or EMS reporting format〗 〖〗 〖paper version: 6500 yuan〗 〖electronic version: 6800 yuan 〖paper + electronic]: 7000 yuan (price discount) 〖Order〗 010-56205768 Phone 〖〗 QQ Service 1271943744, 24 hours: 18,211,180,815 〖Contact〗 〖Zhao Yingying source link〗 http://www.hjwxyjy.com/jixiedianzi/jixie/72187.html (click see text) [Report Contents] Chapter 1: domestic integrated circuit package Industry Progress Background 23 1.1 IC packaging industry definitions and classes 23 1.1.1 IC packaging industry 23 1.1.2 IC packaging industry defined product categories 23 1.1.3 Characteristics of IC packaging industry forecast 24 (1) cyclical industry 24 (2) Industry Regional 25 (3) seasonal industry 25 1.1.4 IC packaging industry's position in the integrated circuit industry forecast 25 1.2 IC packaging industry policy environment conditions forecast 27 27 1.2.1 Industry Management System 1.2.2 industry-related policies 27 (1) "electronic information industry restructuring and revitalization plan" 27 (2) Development and Reform Commission to increase efforts to support the integrated circuit industry 35 (3) Ministry of Science and a special focus on 41 key support for the integrated circuit (4) "further encourage software and IC industry, a number of policy progress "41 (5) of the Customs support software and IC industry policies and measures the progress of the IC packaging industry 46 1.3 Economy 48 1.3.1 International environmental conditions forecast macroeconomic developments Forecast and Analysis 48 (1) international macroeconomic developments forecast 48 (2) analysis of 50 international macroeconomic developments 1.3.2 Dynamic Macroeconomic Forecast and Analysis of China 50 (1) China's macroeconomic dynamics forecast 50 (2) 52 1.4 Dynamic Analysis of China's macroeconomic IC Package Industry Skills environmental conditions forecast 56 1.4.1 Evolution of an integrated circuit package of skills forecasting 56 1.4.2 IC package applications 59 1.4.3 IC packaging process flow forecast 64 1.4.4 IC packaging industry trend of new skills 64 2 Chapter: Progress in the domestic IC industry forecast 67 2.1 IC industry trends 67 2.1.1 Progress Introduction 67 2.1.2 IC industry chain IC industry progress status of dialysis 67 (1) industry good momentum 67 (2) industry skills quickly upgrade 68 (3) to strengthen the competitiveness of the industry has yet to be 68 (4) progress further optimize the industrial structure pattern region 69 2.1.3 IC industry forecast 69 (1) Progress gather pattern has been formed three regions 69 (2) as a whole showed "a axis area, "the distribution of 70 (3) industry as a whole will be" partakers of polyethylene, progress opportunities east West "70 2.1.4 IC industry is facing 71 (1) industrial policy environmental conditions further the better 71 (2) Strategic emerging industries will accelerate the progress of 72 (3) capital markets will provide more opportunities for IC 72 2.1.5 The main problem facing the industry financing 73 (1) small-scale 73 (2) lack of innovation 73 (3) of the value chain Integration is not enough 73 (4) 74 2.1.6 IC industry chain imperfect industry, "second five" Progress Progress analysis 74 2.2 IC design industry trend of IC design industry 74 2.2.1 Overview 74 2.2.2 Advances in IC design industry Progress feature 76 (1) industry continues to expand the range of the number 76 (2) the company's growing 77 (3) the company continues to expand the range of 77 (4) greatly enhance the progress of IC design industry 77 2.2.3 Ability of worries 77 2.2.4 Integrated Circuits Progress strategic design industry 78 2.2.5 IC design industry, "second five" progress analysis 79 2.3 Trends 80 2.3.1 Progress IC manufacturing IC manufacturing dialysis status of progress 80 (1) general overview of progress in IC manufacturing 80 (2) the main features of integrated circuit manufacturing progress 81 (3) 2010 IC manufacturing scope and financial indicators forecast 821) 2010 IC manufacturing, forecasting 822) 2010 IC manufacturing industry profitability forecast 83 3) 2010 IC manufacturing marketing ability to predict 834) 2010 IC manufacturing solvency forecast 835) 2010 Advances in integrated circuit manufacturing capacity forecast 84 2.3.2 2009--2010 manufacturing integrated circuit figure Economic Indicators Prediction 84 (1) The main factors that affect the economic benefits of integrated circuit manufacturing 84 (2) 2009, 2010 - IC manufacturing economy indicators forecast 85 (3) 2008--2010 Different scope of the company share of major economic indicators predict changes in 85 (4 ) 2008, 2010 - The main economic indicators of the different nature of gravity changes forecast 86 (5) 2009, 2010 - a different area of ??economic indicators forecast 87 2.3.3 2009--2010 forecast supply and demand balance in manufacturing integrated circuit figure 89 (1) 2009 2010 National IC manufacturing supply situation forecast 891) 2009--2010 National IC manufacturing output forecast 892) 2009--2010 National IC manufacturing finished goods forecast 89 (2) 2009--2010 National Integration circuit manufacturing demand forecast 891) 2009--2010 National IC manufacturing sales value forecast 892) 2009--2010 National IC manufacturing sales forecast 90 (3) 2009--2010 National IC manufacturing and sales Prediction 90 2.3.4 IC manufacturing industry "five" Progress Analysis 90 Chapter 3: National Progress 93 3.1 IC packaging industry forecasts predict progress in the semiconductor industry semiconductor industry index 93 3.1.1 Estimate 93 (1) The Philadelphia Semiconductor Index and the Dow 93 (2) Electronic Components Taiwan TAIEX Index and 93 (3) CSRC electronics industry index and CSI 300 index 93 3.1.2 The global semiconductor sales forecast 93 (1) of the world semiconductor production value 93 (2) 94 3.1.3 World semiconductor sales worldwide semiconductor industry, mainly the Company 94 (1) 2010 World Top 10 Semiconductor 94 (2) a world leader in semiconductor case the domestic semiconductor industry 94 3.1.4 Overview 97 3.1.5 Advances in semiconductor equipment BB value prediction 100 3.1.6 102 3.1.7 Analysis of the semiconductor industry boom in the semiconductor industry progress 102 (1) industrial chain direction 102 (2) Integrated manufacturers transition to an asset-light 103 (3) the growth of output value every part of the package 104 (4) Package link Outsourcing is also a condition of IC packaging industry 104 3.2 105 3.2.1 Advances in integrated circuit packaging industry forecast predicted range Status Progress 105 3.2.2 3.2.3 105 IC packaging industry dialysis IC packaging industry profitability forecast 106 3.2.4 mainland manufacturers and The industry leader in skills compare 106 3.2.5 IC packaging industry factors predict 107 (1) favorable factors 107 (2) adverse factors IC packaging industry 108 3.2.6 progress and future analysis 109 (1) 109 Prediction progress (2) Future Analysis 112 3.3 112 IC package type 3.3.1 Patent Patent forecast predicted samples constituted 112 (1) Database Select 112 (2) 112 3.3.2 Packaging category search method patents forecast 113 (1) 113 Patent discloses annual status (2) China's foreign patent discloses contrast of 113 (3) Patent Publication major Chinese cities distributed 113 (4) IPC types of skills distribution situation 114 (5) investigate the distribution of the main rights holders IC packaging process 116 3.4 117 3.4 some of the skills issue .1 IC package cracking to produce forecasts and Countermeasures reason 117 (1) package cracking factors predicted 117 (2) control factors that influence cracking method for predicting chip integrated circuit packages 118 3.4.2 crater grounds predict problems and countermeasures 118 ( 1) factors that predict problem crater chip 118 (2) a method for preventing problems arising chip crater 119 Chapter 4: domestic IC packaging industry market demand forecast 121 4.1 121 IC market forecast range of 121 4.1 4.1.1 IC market. 2 IC market structure prediction 123 (1) IC market product structure prediction 123 (2) integrated circuit structure prediction market applications 123 4.1.3 4.1.4 124 IC market competition in China IC 125 4.1.5 Integrated self-sufficiency Market Advances in Circuit Analysis 125 4.2 IC packaging industry demand forecast 126 4.2.1 computer field for industry demand forecast 126 (1) status of the progress of the computer market 126 (2) of integrated circuits in the field of computer application 127 (3), the field of computer industry stimulating demand 127 4.2.2 consumer electronics industry forecast demand for 127 (1) Consumer Electronics Market Status Progress 127 (2) integrated circuits in consumer electronics applications 128 (3) consumer electronics industry needs to pull 128 4.2 .3 communications equipment demand forecast on the industry pulling 128 (1) status of the progress the communications equipment market 128 (2) integrated circuit equipment in the field of communication application 129 (3) communications equipment industry demand for industrial equipment in the field of 129 4.2.4 Demand for the industry forecast 130 (1) Pull the progress status of industrial equipment market 130 (2) integrated circuit devices used in the industrial area of ??130 (3) demand for industrial equipment in the field of industry 131 4.2.5 Demand for automotive electronics industry forecast 131 (1) automotive electronics market progress status of 131 (2) integrated circuits in automotive electronics applications 132 (3) Pull automotive electronics industry needs for other applications 133 4.2.6 Demand forecast of the industry 134 Chapter 5: market competition in the domestic IC packaging industry forecast 5.1 135 IC packaging industry competitive structure of the Porter's five forces model predicts competition between existing competitors 135 5.1.1 135 5.1.2 Key elements of the bargaining power supply 136 5.1.3 Prediction 136 5.1.4 Consumer bargaining power industry forecast predicted 137 potential entrants 5.1.5 risk analysis of alternatives 139 5.2 IC packaging industry pattern of international competition to predict the overall progress 139 5.2.1 International IC packaging market trends 139 5.2.2 International Integration competition in the market trend prediction circuit package 139 5.2.3 International IC packaging market forecast progress 140 (1) high-density packaging skills, high speed and high frequency and low cost 140 (2) changes in the status board material 140 5.2.4 multinational market competition in China forecast 141 (1) the competitiveness of Taiwan ASE Group forecast 1411) Company Profile 1412 Progress) operation of the Company to predict 1413) Main products and applications 1444) the company's market position in the region and industry forecasting 144 5) the case for investment in the domestic market 144 (2) United States Amkor (Amkor) competitiveness of enterprises forecasting 1441) Company Profile 1442 Progress) operation of the Company to predict 1453) Main products and applications 1454) Company Market area and position in the industry predict 1455) Investment in the layout of the domestic market 146 (3) Taiwan SPIL competitiveness of enterprises forecasting 1461) Company Profile 1462 Progress) operation of the Company to predict 1463) Main products and application areas 1474) the company's market position in the region and the industry predict 1475) the layout of the company to invest in the domestic market 147 (4) Singapore STATS-ChipPAC competitiveness of enterprises forecasting 1471) Company Profile 1472 Progress) operation of the Company to predict 1483) the company's main Product applications Camp 1494) and the company's market position in the industry and the region predict 1495) companies to invest in the domestic market, the layout of 149 (5) force into technology shares limited the competitiveness of enterprises forecasting 1491) Advances Company Profile 1492) Operation of the Company Prediction 1493) Main products and applications 1504) and the company's market position in the industry forecast area 1505) Investment in the domestic market, the layout of 150 (6) Freescale competitiveness of enterprises forecasting 1511) Company Profile 1512 progress ) operation of the Company to predict 1513) Main products and applications 1524) the company's market position in the region and the industry predict 1525) companies to invest in the domestic market, the layout of 152 (7) of Infineon Technologies Enterprise Competitiveness forecast 1531) Company Profile 1532 Progress) operation of the Company to predict 1533) Main products and applications 1544) the company's market position in the region and the industry predict 1545) Investment in the layout of the domestic market 154 5.3 IC packaging industry competition pattern of China forecast 155 5.3.1 China's IC packaging industry competition forecast 155 5.3.2 China IC packaging industry concentration predicted 155 (1) the concentration of industry sales forecast 155 (2) concentration of the industry profit forecast 156 (3) of total industrial sector 156 5.3.3 predicted concentration value of China's IC packaging industry internationally competitive predicted 156 Chapter 6: IC packaging industry domestic products market forecast 158 ??6.1 BGA IC packaging industry market forecast 158 ??6.1.1 BGA package 158 6.1 skill level .2 BGA products are mainly used in the field of products 158 6.1.3 BGA demand pull factors range 158 6.1.4 BGA market forecast 159 6.1.5 BGA 159 6.2 Market Forecasts SIP IC packaging industry market forecast 160 6.2.1 SIP package skill level 160 6.2.2 SIP products main application areas demand pull factors 160 6.2.3 SIP products 161 6.2.4 SIP products on the market range forecast 161 6.2.5 SIP 162 6.3 Market Forecasts SOP IC packaging industry market forecast 162 6.3 .1 SOP package skill level 162 6.3.2 SOP 162 6.3.3 Market Situation progress SOP products are applications 163 6.3.4 SOP 163 6.4 Market Forecasts QFP IC packaging industry market forecast 164 6.4.1 QFP package Skills Level 164 6.4.2 QFP products are mainly used in the field 164 6.4.3 Market Situation progress QFP 164 6.4.4 QFP 165 6.5 Market Forecasts QFN IC packaging industry market forecast 165 6.5.1 QFN package skill level 165 6.5.2 Market Situation 166 6.5.3 QFN progress QFN products are mainly used in the field 166 6.5.4 QFN Market Forecasts 166 6.6 MCM IC packaging industry market forecast 167 6.6.1 MCM packaging skills before 167 (1) Concepts 167 ( 168 6.6.4 Status Progress 170 6.6.5 MCM MCM products market products market 2) MCM package types 167 6.6.2 MCM products are mainly used in the field of products demand 168 6.6.3 MCM pull factors predict future IC packaging industry 171 6.7 CSP Market 171 6.7.1 CSP package prediction skills before 171 (1) Concepts 171 (2) CSP Features 172 (3) CSP package types 173 (4) CSP packaging processes 174 6.7.2 CSP products are mainly used in the field 176 6.7. Progress in product market situation 3 CSP 176 6.7.4 CSP Market Forecasts other products on the market 177 6.8 178 6.8.1 IC packaging industry forecast wafer level packaging market forecast 178 (1) Concepts 178 (2) Features 178 (3 ) The main application areas 179 (4) market scope with major suppliers 179 (5) 180 6.8.2 Forecasts flip-chip / packaging market forecast down 180 (1) Concepts 180 (2) Features 180 (3) market over the next 181 6.8.3 3D packaging market forecast 181 (1) Concepts 181 (2) encapsulation method 183 (3) Advances Present and Future 184 Chapter 7: The domestic IC packaging industry's major companies operating forecast 7.1 186 IC packaging companies progress overall trend Prediction 186 7.1.1 IC packaging industry manufacturer of industrial output ranked 186 7.1.2 IC packaging industry manufacturers sales rankings 186 7.1.3 IC packaging industry manufacturers a total profit of 7.2 Ranked 186 IC packaging industry leader Case Freescale Semiconductor 187 7.2.1 Prediction (domestic) limited business case forecast 187 (1) Company Brief prediction progress 187 (2) the ability to forecast production and marketing company 187 (3) company forecast 187 (a) company solvency forecast 187 (b) the ability to predict marketing 189 (c) the company's profitability forecast 192 (4) of product structure and new product trends 193 (5) sales channels and network 194 (6) the advantages and disadvantages trend forecasting company 194 7.2.2 K News Joint Semiconductor (Beijing) Co., the business case forecast 194 (1) Company Brief prediction progress 194 (2) major economic indicators forecast 195 (a) company solvency forecast 195 (b) marketing ability to predict 196 (c) earnings the ability to predict 199 (3) the ability to forecast production and marketing company 200 (4) of product structure and new product trends 201 (5) sales channels and network 201 (6) the advantages and disadvantages trend forecasting company 201 7.2.3 Jiangsu Changjiang Electronics Technology Co. Shares Forecast of business 201 (1) Company Brief prediction progress 201 (2) major economic indicators forecast 202 (a) company solvency forecast 202 (b) marketing ability to predict 204 (c) of the company's profitability forecast 206 (3) Company Organization predicted 208 (4) of product structure and new product trends 208 (5) sales channels and network 208 (6) the advantages and disadvantages trend forecasting company 211 (7) Investment forecast 211 Merger and restructuring (8) The latest progress Forecasting Trends 212 7.2.4 Shanghai Matsushita Semiconductor Co. business case forecast 212 (1) Company Brief prediction progress 212 (2) the ability to forecast production and marketing company 212 (3) major economic indicators forecast 213 (a) company solvency forecast 213 (b ) marketing ability to predict 215 (c) of the company's profitability forecast 217 (4) product mix and new product trends 218 (5) sales channels and network 219 7.2.5 Shenzhen STS Microelectronics Co. business case forecast 219 ( 1) Company Brief prediction progress 219 (2) the ability to forecast production and marketing company 219 (3) major economic indicators forecast 219 (a) company solvency forecast 219 (b) marketing ability to predict 221 (c) the company's profitability forecast 224 (4 ) product mix and new product trends 225 (5) sales channels and network 227 (6) the advantages and disadvantages trend forecasting company 227 (7) of the latest progress trends forecast 228 Chapter 8: domestic IC packaging industry forecasts and investment advice 230 8.1 IC packaging industry forecast investment properties 230 8.1.1 IC packaging industry and investment barriers 230 (1) Skills Barriers 230 (2) financial barriers 230 (3) Personnel barrier 231 (4) demanding customer certification system 231 8.1.2 IC packaging industry profit model 231 8.1.3 IC packaging industry profitability factor 232 8.2 IC packaging industry investment forecast 233 8.2.1 Merger and restructuring IC packaging industry merger and reorganization and integration of investment before 233 8.2.2 International IC packaging company Merger and reorganization and integration of investment forecast 233 8.2.3 China IC packaging companies to invest in mergers and acquisitions integration and forecast 233 (1) through rich micro-power business investment Merger and restructuring forecast 233 (2) Huatian Technology investment Merger and restructuring forecast 234 ( 3) long power technology enterprise investment Merger and restructuring forecast 235 8.2.4 IC packaging industry merger and reorganization and integration of investment status forecast 8.3 235 IC packaging industry forecast investment and financing 236 8.3.1 Electronic Fund to support the progress of the integrated circuit industry forecast 236 (1) Electronic Progress Fund to support the case for the integrated circuit industry 236 (2) Electronic Progress Fund to support the views of the integrated circuit industry 238 8.3.2 IC packaging industry financing costs 238 8.3.3 Prediction semiconductor industry capital spending forecast 238 8.4 Integration circuit packaging industry investment advice IC packaging industry 239 8.4.1 Investment Opportunities 8.4.2 239 IC packaging industry forecast investment risk analysis 241 8.4.3 241 IC packaging industry investment advice (1) Investment Area opinion 241 (2) Investment influence of the advanced stage of opinion 241 (3) Skills Upgrading comments Charts Chart 1 242 24 Life Cycle Chart 22009--2012 global economic growth forecasts in the form of an integrated circuit package 48 Chart 3 Process 64 Figure 4 IC industry chain 67 Figure 5 2011 China's IC design owners to index 75 Chart 6 China's major IC design companies Chart 7 76 listed companies in the domestic IC design industry 76 Chart 82010--2012 integrated circuit figure 83 manufacturing industry profitability forecast chart 92010--2012 integrated circuit figure the ability to predict manufacturing industry marketing 83 chart 102010--2012 integrated circuit figure 83 manufacturing industries solvency prediction table 112010--2012 integrated circuit figure 84 manufacturing industry asset growth forecast table 122010--2012 integrated circuit figure outlines the main economic indicators manufacturing industry 85 Exhibit 13 2012 January-November domestic IC manufacturing industry the number of different types of company structure prediction% 85 Exhibit 14 2012 January-November sales of different types of structure prediction% domestic IC manufacturing industry in 2012 85 Exhibit 15 1-11 May domestic IC manufacturing industry the number of companies with different ownership structure prediction% 86 Exhibit 16 2012 January-November sales different ownership structure prediction domestic IC manufacturing industry 87% form 172010--2012 same period IC manufacturing industry in Shandong Province's major economies Index Overview 87 form 182010--2012 IC manufacturing industry in Shanghai earlier outlined 87 major economic indicators form 192010--2012 Anhui IC manufacturing industry over the same period of major economic indicators overview table 88 20 2010 - Guangdong Province in 2012 year IC manufacturing industry 88 major economic indicators overview table 212010--2012 same period, Jiangsu Province, IC manufacturing industry outlined 88 major economic indicators chart 222010--2012 National IC manufacturing output forecast 89 chart 232010--2012 National Semiconductor Manufacturing Finished industry forecast 89 chart 242010--2012 National IC manufacturing sales value forecast 89 chart 252010--2012 National IC manufacturing sales forecast 90 chart 262010--2012 National IC manufacturing and marketing rate forecast 90 Exhibit 27 Exhibit 28 103 IC industry chain IDM tier asset restructuring in recent years began to light 104 chart 292010--2012 integrated circuit figure packaging industry profitability forecast 106 Chart 30 China IC packaging and testing firms packaging and testing five skills and industry vendors the gap before the 20 patented invention and affiliated companies 107 31 IC patent distribution trend chart country Province, China Exhibit 32 114 species of China's IC patent IPC 114 Exhibit 33 foreign IC patent IPC 115 chart types of integrated circuits manufacturing 34 116 Chart 352008--2012 world semiconductor market and increase the range of 122 Chart 362008--2012 domestic IC market sales scope and growth of 122 Exhibit 37 2012 China's IC market product structure diagram 382 012 123 domestic IC market applications Structure 124 Exhibit 39 2012 125 domestic IC market brand structure chart 402008--2015 domestic IC market growth range 126 Exhibit 41 2015 China's IC market application structure and growth 126 Chart 422011--2012 domestic computer market case 127 Chart 43 IC packaging industry, environmental conditions, "Porter's five forces' recent prediction model 135 Chart 44 Forecast of Taiwan ASE Group operates 141 Exhibit 45 US Amkor (Amkor) the business case forecast chart 145 46 Taiwan SPIL business situation Singapore recently forecast 47 146 chart STATS-ChipPAC business situation recently forecast 48 148 chart Powertech Technology Co., the business case forecast 149 Chart 49 recent cases of Freescale's business forecast 151 Chart 50 Infineon Technologies business situation recently forecast 153 Chart 51 China IC packaging industry sales forecast 155 chart concentration 52 Chinese IC packaging industry profit forecast 156 chart concentration 53 Chinese IC packaging industry output concentration prediction charts 54 156 2010-2012 159 BGA market forecast range Chart 55 2010-2012 forecast range of SIP products on the market 161 56 2010-2016 chart QFP market forecast and predict the future 165 Chart 57 2010-2016 QFN market forecast and predict the future 166 Chart 58 2010-2016 CSP market forecast and future forecast chart 592 012 177 integrated circuit figure packaging industry manufacturer of industrial output ranking chart 602 012 186 integrated circuit figure packaging industry manufacturers sales rankings map 61 186 2012 IC packaging industry Manufacturer gross profit ranking chart 622 012 186 In Freescale Semiconductor (domestic) limited ability to forecast sales of 187 companies in nearly four years Form 63 Freescale Semiconductor (China) Co., the rate of change of corporate assets and liabilities 64 187 chart nearly three years Freescale Semiconductor (China) Co., corporate assets and liabilities rate changes in the past four years 188 Form 65 Freescale Semiconductor (China) Co., 188 enterprises equity ratio changes in the past three years Chart 66 Freescale Semiconductor (China) Co., 189 enterprises equity ratio changes in the past four years Form 67 Freescale Semiconductor (domestic) limited number of cases fixed assets turnover the past three years 189 Chart 68 Freescale Semiconductor (China) Co., fixed assets 190 Form 69 turnovers case for nearly four years, Freescale Semiconductor (China) Co. Enterprise Liquid Assets turnaround times changes in the past three years 70 190 chart changes Freescale Semiconductor (China) Co., 191 companies Turnover of Working Capital table 71 in nearly four years, Freescale Semiconductor (China) Co., total assets turnover frequency changes in the past three years 72 191 Chart Freescale Semiconductor (China) Co., total assets turnover frequency changes in the past four years 192 Form 73 Freescale Semiconductor (China) Co., changes in business sales margin of nearly three years, 192 Chart 74 Freescale Semiconductor (China) Enterprise Co., changes in gross margin 193 75 table nearly four years RFMD (Beijing) Co., the rate of change of corporate assets and liabilities 76 195 chart nearly three years RFMD (Beijing) Co., the rate of change of corporate assets and liabilities of nearly 4 195 Form 77 On RFMD (Beijing) Co., changes in corporate equity ratio of nearly 78 196 Chart 3 years RFMD (Beijing) Co., changes in corporate equity ratio of nearly 4 196 Form 79-year RFMD (Beijing) Co., fixed assets 197 Chart 80 turnovers case nearly three years RFMD (Beijing) Co., fixed assets turnover times 197 Form 81 case for nearly four years RFMD (Beijing) Co., corporate liquidity flow chart 82 the number of changes in the past three years 197 RFMD (Beijing) Co. business turnover frequency changes in current assets 83 198 table nearly four years RFMD (Beijing) Co., total assets turnover frequency changes in the past three years 84 198 Chart RFMD (Beijing) Co., The total assets turnover frequency changes in the past four years 85 199 form RFMD (Beijing) Co., gross changes in corporate sales 86 199 chart nearly three years RFMD (Beijing) Co., gross changes in corporate sales 87 200 Chart 2012 United Granville Semiconductor (Beijing) Co., the ability to predict corporate sales 88 200 form nearly four years Jiangsu Science and Technology Co., the rate of change of corporate assets and liabilities 89 202 chart nearly three years Jiangsu Science and Technology Co., the rate of change of corporate assets and liabilities 202 table 90 in nearly four years, Jiangsu Changjiang Electronics Technology Co., changes in corporate equity ratio of nearly 3 203 Chart 91 Jiangsu Changjiang Electronics Technology Co., changes in corporate equity ratio of nearly 92 203 Form 4 years Jiangsu Science and Technology Co., the fixed asset turnover Chart 93 cases 204 times the past three years, Jiangsu Changjiang Electronics Technology Co., the fixed asset turnover situation 204 form 94 times the past four years, Jiangsu Changjiang Electronics Technology Co. corporate liquidity flow chart 95 times 205 changes the past three years, Jiangsu Changjiang Electronics Technology Shares Turnover of Working Capital Enterprises Ltd. changes form 96 205 in nearly four years, Jiangsu Changjiang Electronics Technology Co., total assets turnover times 205 chart changes in the past three years 97 Jiangsu Science and Technology Co., the total assets of the number of changes in the turnover of nearly 206 table 98 4 Jiangsu Changjiang Electronics Technology Co., changes in business sales margin of nearly 3 206 Chart 99 Jiangsu Changjiang Electronics Technology Co., gross changes in corporate sales chart 207 100 Jiangsu Changjiang Electronics Technology Co. organizational structure chart 1012012 208 in Shanghai Matsushita Semiconductor Co. ability to predict corporate sales 102 212 table nearly four years Shanghai Matsushita Semiconductor Co., changes in the rate of corporate assets and liabilities 125 213 table nearly four years, Shenzhen STS Microelectronics Co., changes in business sales margin of nearly 3 224 Chart 126 Shenzhen Race STMicroelectronics limited changes in corporate sales margin 225 127 ASE and SPIL chart Financing Activities 238 ---------------------------- Ms. Gao -----------〗 〖Contact〗 010-56205768 Miss Zhao 〖Order〗 〖QQ 1271943744 24: 18211180815