CMI563 (portable surface copper thickness)

Oxford Instruments CMI563 surface copper thickness measuring instrument designed to measure the thickness of the copper foil surface design of rigid and flexible, single, double or multi-layer printed circuit board. The entire instrument consists of a versatile handheld gauge (with protective cover), measuring probe and NIST (National Institute of Standards and Technology) certified calibration standard slices. Micro-resistance technology SRP-4 probe is Oxford Instruments company's patented product, the probe can wear in the field quickly and easily replaced, the downtime to a minimum. Replacing the probe module than replace the entire probe economy. ? Application? Characteristics? Measurable surface copper thickness rigid and flexible, single, double or multi-layer printed circuit board? Measuring foil thickness of the display unit as mils or μm? May be used to foil incoming inspection, After plating copper surface copper thickness of the test? detect printed circuit board chemical copper or copper plating thickness? precise quantitative measurements of the thickness of the copper foil etching or after leveling? 16 keys, 4 digit LCD display, lightweight and durable? SRP-4 Probe Oxford Instruments company's patented product, the probe can wear in the field quickly and easily replaced, the downtime to a minimum? micro-resistance testing technology thick copper foil application provides high measurement accuracy? RS-232 serial interface for downloading to a printer or computer statistical report:? storage location, measuring the number of copper foil type, measurement date / time, mean, standard deviation, variance percentage, accuracy, highest value, lowest value, value domain, CPK values, bar charts