Wafer cutting wire plating equipment, silicon diamond wire equipment

Wafer cutting wire plating equipment, silicon diamond wire equipment 2. Production diameter: 0.12-0.25 equipment ordered Mr. Hsu 18913612352mm 3, produce wiring harness: 15-20m / min 4, Line Number: 1 5, process: put Line - washing - hot water - high pressure wind - pickling - washing - washing - deionized water - High - Recycling - washing 6, each process description: Negotiable specific equipment ordered telephone; 18,913,612,352 Xu