Taiwan Tin Tin - lead-free solder Sn-Cu0.7

Taiwan Tin Tin - lead-free solder lead-free solder bar -TTIN brand features: ★ pure tin manufacturing, wettability, good fluidity, easy on the tin. ★ spot light, full, not Weld and other undesirable phenomena. ★ sufficient amount of antioxidant elements, strong antioxidant capacity. ★ pure tin manufacturing, less dross, reduce unnecessary waste. ★ lead-free RoHS standards for peak or hand Baptist furnace operation. Solder has the following advantages: less than ordinary solder 1. slag after melting, and has excellent antioxidant properties; 2. the melted low viscosity, good fluidity, weldability high, ideal for wave soldering processes; 3. few inclusions due to oxidation, can minimize pull tip bridging phenomenon, welding quality and reliable, full bright spot. 1. Lead-free solder advantages and scope of the company's environmentally friendly lead-free solder, has excellent wettability, good shear strength, creep resistance sufficient, thermomechanical fatigue resistance and other mechanical properties of and good liquidity, welding high reliability, can inhibit the bridging and other negative phenomena, improve the welding effect, tin slag generation rate. The product is suitable for high-precision electronics industry wave soldering, reflow and hand soldering and other processes, customers are the best choice of products. 2.1. a lead-free solder lead-free solder quality characteristics Sn Ag3.0 Cu0.5 / Sn Ag0.3 Cu0.7 / Sn Cu0.7 main ingredient impurities form an alloy chemical composition% Sn Ag Cu Pb Sb Fe Zn Bi Al As In balance Ni Cd SnAg3.0Cu0.5 3.01 0.516 <0.1 <0.1 <0.02 <0.001 <0.1 <0.001 <0.03 <0.02 <0.01 <0.002 SnAg0.3Cu0.7 balance 0.301 0.706 <0.1 <0.1 <0.02 <0.001 <0.1 <0.001 <0.03 <0.02 <0.01 <0.002 Sn Cu0.7 balance 0.001 0.705 <0.07 <0.1 <0.02 <0.01 <0.1 <0.01 <0.03 <0.02 <0.01 <0.002 Pb-free solder SnAg3.0Cu0.5 / Sn Ag0. 3 Cu0.7 / Sn Cu0.7 chemical composition of Table II NO Project Results Test Method 1 alloy SnAg3.0Cu0.5 SnAg0.3 Cu0.7 Sn Cu0.7 2 share 7.4 7.38 7.31 3 proportion instruments melting temperature ℃ 217 222 227 heat Analysis of temperature elevation rate 20 ℃ / mm 4 Thermal conductivity 64 # 65 # 64 # 5 estimated value Elongation% 525 332 tensile testing machine 10mm / mim25 ℃ 6 spreading factor 240 ℃ 78% 78% 76% 250 using Flux Test ℃ 78% 78% 76% 260 ℃ 79% 79% 77% 270 ℃ 79% 79% 77% 7 wettability Ta Tb Fmax Ta Tb Fmax Ta Tb Fmax wetting balance test copper 0.3 * 3.5 * 2.5mm 240 ℃ 0.72 2.1 0.213 0.85 3.01 0.198 1 4.53 0.189 250 ℃ 0.37 1.46 0.213 0.71 2.52 0.195 0.86 2.79 0.186 260 ℃ 0.23 0.81 0.192 0.38 1.32 0.189 0.47 1.46 0.183 270 ℃ 0.21 0.48 0.183 0.28 0.65 0.182 0.31 0.8 0.179 8 Resistivity (% LACs) 15 14 13 terminal method 25 ℃ 9 copper corrosion test Pass Pass Pass test used 0.2mm copper wire off 10 creep strength test> 300 hrs> 300 hrs> 300 hrs with heavy 1KG145 ℃ test> 300 hrs> 300 hrs> 300 hrs with heavy 1KG145 ℃ test> 300 hrs> 300 hrs> 300 hrs test 11 with a heavy 1KG145 ℃ thermal shock test Pass Pass Pass -40 / 80 ℃ test 12 ions migrate over 1000 hours> more 1000hrds 1000 小时> over 1000hrds 1000 小时> 1000hrds 40 ℃ 95% Operating temperature test 13 with reference to FIG. 2 with reference to FIG. 1 with reference to FIG. 3 antioxidant tin lead-free: Product Features: Suitable for hand dip soldering, wave soldering circuit boards bright spot, producing slag less, operating temperature above the melting point 40 ~ 60 ℃ work best. Grade alloy composition melting point (℃) gravity Proposed Use solidus liquidus T101A Sn99.95 232 232 7.28 peak furnace added, lowering the copper content T703A Sn-Cu0.3 227 230 7.31 T705A Sn-Cu0.5-Ni 226 226 7.32 board hand dip soldering, wave soldering T707A Sn-Cu0.7 227 227 7.32 T303A Sn-Ag0.3-Cu0.7 217 228 7.33 T330A Sn-Ag3.0-Cu0.5 217 218 7.40 Lead (dip lines, spray tin) for the tin: Product Features: Suitable for components feet, bare copper immersion tin and board HASL process, the working temperature of 300 ~ 380 ℃ operating temperature melting point alloy component grades (℃) weight () recommends the use of solid phase line liquid line T101A Sn99.95 232 232 7.28 add tin, lowering the copper content T705A Sn-Cu0.5-Ni 226 226 7.32 HAL open cylinder with T705N Sn- Ni0.02 230 232 7.28 HAL added with T707 Sn-Cu0 .7 227 227 7.32 No member feet, bare copper impregnated high-temperature lead-free tin: Product Features: Suitable for wire, transformer primary stripping, fast on the tin, working temperature of 400 ~ 480 ℃ work best, tin and smooth surface We can not afford to film, the first transformer products. Grade alloy composition melting point (℃) weight () Proposed uses solidus liquidus T707B Sn-Cu0.7 227 227 7.32 enameled wire, transformers immersion tin T330B Sn-Ag3.0-Cu0.5 217 218 7.40 low lead tin: Product Features: Suitable for electronic temperature control devices, fire alarms, advanced buildings, the amount of libraries, high pressure food utensils, special corners craft, glass ceramics weldments, mold molding manufacturing processes. Melting point alloy composition (℃) proposed use Sn-Cu-Bi approximately 200 220 ℃ solder Sn-Bi approximately 138 180 ℃ solder lead-free solder melting point properties Description Category (℃) Tensile strength () elongation (%) Sn-Ag- Cu 217 5.3 27 Sn-Ag 221 4.7 33 Sn-Cu 227 3.3 48 Sn-Bi 138 7.6 33 tin solder is a product, tin and can be divided into two without Tin Tin, are It is a circuit board welding. Pure tin manufacturing, wettability, good fluidity, easy on the tin. Spot light, full, not Weld and other undesirable phenomena. Adding a sufficient amount of antioxidant elements, strong antioxidant capacity. Pure tin manufacturing, less dross, reduce unnecessary waste. Tin Caution: First, the working temperature of the second solder impurities pollution limit three, wave soldering dross removal of solder dross is formed on the oxide surface, its production rate is in accordance with the temperature and agitation dependent. The higher the temperature and the greater the stirring flow soldering surface, the more dross formation. Antioxidants may also be added leaving the tin surface forming a protective film to reduce the tin oxide. The solder surface oxides prevents the solder re-oxidation, therefore, do not always clear the scum. As long as it does not affect the waves push to clean it once a day. Tin slag can also be pushed to a corner, add the dross reduction powders and then stir the majority of dross can be reduced to tin. Fourth, new wave soldering tin added in the wave soldering process, the amount of tin will continue to decrease, when reduced to a certain extent, it is timely to add a new tin. To maintain the reduced level of tin oxide, tin wave due to great difference in the tin. V. Cu impurities removal (Lead), tin solder furnace component (unleaded) regular inspection when Cu exceeds its solubility in Sn, the intermetallic formation between Cu and Sn, usually Cu6Sn5 , the melting point of the compound above 500 ℃, so it is in a solid form. This Cu-Sn between excessive presence of metal compounds will seriously affect the quality of welding. Conventional Sn-Pb solder gravity of 8.4, tin copper Cu6Sn5 impurity is 8.28. Thus the available weight method "copper" in the lead manufacturing process. Upcoming furnace temperature down to about 190 ℃ (tin-lead solder is still liquid at this time), then stir solder for about 1 minute and then allowed to stand for more than eight hours. Since Cu6Sn5 small proportion than tin, the compound will float on the surface of the solder, clear the upper impurities coming Cu impurities removed. In addition to two weeks or a month or so Cu once, thus reducing the number of changes in grooves, and reduce costs. The proportion of lead-free solder (usually around 7.4) than the proportion of small tin-copper, tin and copper impurities will sink into the bottom of the pot, it is unable to lead manufacturing process like weight method "Copper" Copper remove impurities. It should be monitored regularly in the solders ingredients, when copper and lead found near the maximum allowable standards, the timely replacement of solder. Depending on the customer yield, it is recommended 1 to 2 months clean stove again.