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asm wire bonders, automatic wire bonders, ks wire bonders, EagLe60 wire bonders warranty Training
asm wire bonders, automatic wire bonders, ks wire bonders, EagLe60 wire bonders warranty Training
asm wire bonders, automatic wire bonders, ks wire bonders, EagLe60 wire bonders warranty Training
asm wire bonders, automatic wire bonders, ks wire bonders, EagLe60 wire bonders, wire bonders ASM train warranty, EG60 installation requirements for voltage 100 \ 115 \ 200 \ 208 \ 220 \ 230 \ 240 VAC single-phase 50/60 Hz ± 3Hz minimum pressure 65 psi (. 142 liters / min @ 4.6kg / cm 2) Operating Environment 59 ℉ -. 86 ℉ (15 ℃ -30 ℃) take competency framework is contained length 3.5 to 10.5 in (90 to 267 mm ) frame width 0.60 to 3.5 in. (15.2 to 88.9 mm) frame thickness 0.004 to 0.035 in. (0.10 to 90 mm) crystal base recess distance Up to 0.090 in. (2.3 mm) spacing of the crystal is located 0.1 to 3.5 in . (2.5 to 90 mm) guide pin pitch 0.0026 in. (66 um) with 1 mil (25 um) wire lead foot width of 0.0016 in. (40 um) with 1 mil (25 um) wire lead foot minimum width of 1 mil ( 25 um) pod size width 0.7 to 3.375 in. (20 to 95.3 mm) length of 5.00 to 10.75 in. (127 to 273 mm) height of 2.0 to 7.0 in. (50 to 178 mm) groove spacing 0.050 to 1 inch ( 1.27 to 25 mm) maximum weight of 10 pounds (4.5 kilograms) features the smallest crystal crystal size 45umX45um rotation angle +/- 5 degree @ default box size of 0.5 mm x 0.5 mm) maximum tilt +/- 0.0024 in. (60 um) corner-to-corner optical imaging systems and electronic imaging systems double the number of the optical lens eye 300 groups to identify electrical solder wire capability height difference 0.030 in. (0.75mm) maximum capacity of 2000 the number of wire lines (due to release much and vary) wire area 2.0 in x 2.5 in. (50.8 mm x 58.4 mm) diameter 0.8 mil (23 um) to 1.3 mils (33 um) line arc maximum length 0.300 in. (7.6 mm) (select different LOOP vary) solder position offset ± 5 um St. Regis Shenzhen Technology Co., Ltd. is a professional development and production of electronic equipment companies, mainly in equipment technology research and development, sales and marketing oriented industry, has introduced a high-level scientific and technological content of LED automated production lines and other products. St. Regis Shenzhen Technology Co., Ltd. is a company specializing in the design and manufacture of electronic components semiconductor equipment business, the company only founded in 1999, is a research and development, sales and service in one integrated enterprise. The company's products with automatic LED solid crystal, automatic wire bonders, automated transformation based. Companies introducing advanced foreign technology and processes, combined with user needs production, independent development, manufacturing. Company to "high-tech, high-quality, high efficiency" for the purpose of "honest and trustworthy" principle, with reliable product quality, good cost performance and improve after-sales service, as always, work together with customers and friends , and create brilliant. St. Regis technology companies or KAIJO Group authorized sales LED automatic wire bonders equipment distributor in China, the company continued to send engineers to go out training, and strive to provide customers with advanced surface production equipment but also offers a full-better quality, better service . Facing the new century, the St. Regis Infotek willing to cooperate with all customers, and common development Main: KS SERIES wire bonders, solid crystal machine Canon, constant temperature heating units, rub board fiber rods, ccc aluminum, steel mouth, porcelain mouth ..
Contact Detail
Company Name: | St. Regis Shenzhen Technology Co., Ltd. |
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Employee Number: | |
Annual export: | |
Year Established: | |
Contact Person: | Mr. ZHOU Flowers(ZHOU flower manager) |
Telephone Number: | 0755-29959477 |
Company Address: | 47, 5th Floor, Bao'an District of Shenzhen City West township Po Tin Industrial Zone, Shenzhen City, Guangdong, China |
Zip/Postal Code: | 518102 |
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