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Supply KS8028 automatic gold wire machine, high power flat wire bonders, warranty, there are training
Supply KS8028 automatic gold wire machine, high power flat wire bonders, warranty, there are training
Supply KS8028 automatic gold wire machine, high power flat wire bonders, warranty, there are training
KNS wire bonders, KS8028, installation requirements voltage 100 \ 115 \ 200 \ 208 \ 220 \ 230 \ 240 VAC single-phase 50/60 Hz ± 3Hz minimum pressure 65 psi (142 liters / min. @ 4.6kg / cm 2) Job Environment 59 ℉ -.. 86 ℉ (15 ℃ -30 ℃) take competency framework is contained length 3.5 to 10.5 in (90 to 267 mm) frame width 0.60 to 3.5 in (15.2 to 88.9 mm) frame thickness 0.004 to 0.035 in. (0.10 to 90 mm) crystal base recess distance Up to 0.090 in. (2.3 mm) spacing of the crystal is located 0.1 to 3.5 in. (2.5 to 90 mm) guide pin pitch 0.0026 in. (66 um) with 1 mil ( 25 um) wire lead foot width of 0.0016 in. (40 um) with 1 mil (25 um) wire lead foot minimum width of 1 mil (25 um) pod size width 0.7 to 3.375 in. (20 to 95.3 mm) length of 5.00 to 10.75 in. (127 to 273 mm) height of 2.0 to 7.0 in. (50 to 178 mm) groove spacing 0.050 to 1 inch (1.27 to 25 mm) maximum weight of 10 pounds (4.5 kilograms) features the smallest crystal rotation crystal size 60umX60um angle of +/- 5 degree @ default box size of 0.5 mm x 0.5 mm) maximum tilt +/- 0.0024 in. (60 um) corner-to-corner optical imaging systems and imaging systems electronic single-magnification optics Identification Number electric eye 300 Group capacity wire wire area 2.0 in x 2.5 in. (50.8 mm x 58.4 mm) joint height difference 0.030 in. (0.75mm) maximum capacity of 2000 the number of wire lines (not much vary depending on the version) line Trail 0.9 mil (23 um) to 1.3 mils (33 um) line arc maximum length 0.300 in (7.6 mm) (select different LOOP vary) solder position offset ± 5 um Product description:. KS8028 automatic gold wire ball bonders are mainly used in light-emitting diodes, small and medium-power transistors, integrated circuits and special semiconductor devices inner lead soldering for SMD Chip stand: 3528,5050,0603,0805,1206, etc; large power LED, power LED side shooter type, DIP, etc; piranhas bracket: recessed series, flat head series; ordinary bracket:, Φ5, Φ8,10Φ, oval series, hat head series, flashing lights, color lights, launch LED tube receiver tube series bracket welding. Advantages: 1 save labor, a person can operate 4-5. 2 can be operated as novices, novices can learn Confirmed in half an hour. 3 more capacity, the existing gold ball wire bonders by single output after the transformation can be increased by 30%. 4 improve quality, quality after renovation LED wire bonders station will be greatly enhanced. 5 reduce material waste, after yield improved material can be wire station less waste. 6 employees do not operate under the microscope, effectively reducing the labor intensity of workers, so that employees work more humane, thus effectively reducing the mobility of wire station personnel. 7 high degree of automation: picking up images by computer to calculate the precise position control of skateboarding by the CCD camera after wire
Contact Detail
Company Name: | St. Regis Shenzhen Technology Co., Ltd. |
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Employee Number: | |
Annual export: | |
Year Established: | |
Contact Person: | Mr. ZHOU Flowers(ZHOU flower manager) |
Telephone Number: | 0755-29959477 |
Company Address: | 47, 5th Floor, Bao'an District of Shenzhen City West township Po Tin Industrial Zone, Shenzhen City, Guangdong, China |
Zip/Postal Code: | 518102 |
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