Supply - unleaded Paste low - Environmental welding material - low paste

Low-temperature lead-free solder paste from the low oxidation degree spherical solder powder and special solvent composition, can effectively protect the global environment, with good environmental properties. Specifically designed to meet the post-weld-free cleaning, and after welding residue decomposition will not occur. Has a great range of selectable process parameters can ensure the continuity of the excellent printing, anti-collapse ability, surface insulation resistance performance. Under conditions of continuous printing paste still has 12 hours to ensure good adhesion. Characteristics at low temperature solder paste 1, melting point 139 ℃ 2, 3 fully RoHS compliant, excellent printability, eliminate printing process omission depressed and caking phenomenon 4, good wetting, bright solder joints full uniform 5, reflow When Wuxi beading and bridging produce 6, long stick life, long life printing stencil 7, process technology for a wide and fast printing of lead-free solder 12 hours 6 hours of continuous printing capacity without the need collapse timetable gas viscosity continued to maintain protection unchanged 16miI (0.4mm) printable electronics industry uses for SMT placement process from printing and ultrafine pitch Jane IPC choose different types of solder alloy end after cleaning a lead-free no-clean solder paste low temperature. No cleaning residue after soldering.