Epoxy epoxy mold release formulations release agent composition testing

 Epoxy resin structure containing hydroxyl and ether bond, because of these polar groups, so that the contact interface between the epoxy resin and has a strong molecular attraction, while they can and certain epoxy material surface (e.g., a metal surface active hydrogen from) the reaction to form chemical bonds, therefore, with a variety of epoxy adhesive material, the "all-purpose adhesive," said. In the epoxy resin applications, most contact material is a metal, plaster, wood, plastic, etc., most of them with an epoxy resin has strong adhesive strength, in order to prevent these materials with an epoxy resin adhesive, must using a release agent. According to the polarity of the theory, only the polarity of similar material can be a good bonding, so a release agent for epoxy resins should be a non-grade material. Shenzhen set of universal technology for the provision of epoxy release agent composition testing, release agent component epoxy content ratio analysis, mold release agents of unknown composition tests epoxy resin pultrusion, cast resin curing mold release formulations, high temperature epoxy release agent component identification. Testing and counseling: Contact: blue 'S Tel: 0755-25844177 Fax: 0755-25844877 Mobile: 18028719381 Website: http: //jisihai8888.b2b168.com mail: 360620865@qq.com