Without Tin Tin Hanson manufacturers _ _ Anyang without Tin manufacturers

Tin tin slag many reasons: the usual furnace cleaning is also critical Xi'an free solder bar manufacturer, for a long time no clear furnace, high impurity content in the furnace without Tin Zhengzhou manufacturer, also cause excessive dross one of the reasons. To solve the wave-free solder dross excessive production factory in Shandong, because copper content exceeded, periodically clean the furnace, about every six months or a year for a new tin is more appropriate. Solder Technology: When entering the peak before the end of the PCB (A), the substrate is heated with the pin, and not to leave the crest surface (B) until the entire PCB immersed in the solder, namely the solder bridging, but leave crest moment the trailing end, due to a small amount of solder wetting force, adheres to the pad, and due to surface tension, appears to lead to a minimum state of contraction as the center, the wetting between the solder and the pad at this time force is greater than the cohesion of the solder between the two pads. Therefore, the formation of full, rounded solder joints, leaving the crest of excess solder tail, due to gravity, down to the tin pot. Prevent bridged.