Power silicone molding packaging

LED module top special silicone I. Introduction LED Silicone mold top special package for the two-component liquid silicone encapsulants. Mainly used in imitation lumen mold top and car lights (integrated chip) die top two categories. After curing has high hardness and high transparency and high light efficiency. This product is excellent electrical properties of PA, PMMA, PCB board, good adhesion and sealing, (packaged cakes lamp beads plastic tweezers peeling difficult, multi-residue). After the package can be improved lamp beads external shocks, vibration resistance, improve internal components, insulation between the lines, the LED has good durability and reliability. Second, the product features high transmittance, easy deaeration, good flow properties. Lamp beads packaged with good light scattering properties, no spot, high lumens, (than ordinary silicone encapsulation lumen lamp beads up about 3 per watt), and even change the light fades, light attenuation (Experiment Testing was lit 3000 a small decline of less than 4%). Third, the use of 1, a weight ratio of A: B = 1: 1 ratio with glue and mix well. 2, vacuum degassing 20 minutes (time can be adjusted according to the degree of vacuum size). 3, prior to dispensing, please stand preheat 60 minutes in addition to wave at 150 ℃. As soon as possible before the stent not re-absorb moisture sealant. 4, the first 80 ℃ bake 1 hour, then heated to 150 ℃ bake 3.5 hours, bubble segmentation curing can effectively solve the problem to improve the yield. Fourth, note storage, use and process must ensure that phosphorus (P), sulfur (S), contacting nitrogen (N) and organic tin (Sn) and other compounds.