Bondplys MG31 high bondplys

Bondplys | MG31 high bondplys Business Contact: Vonnie (President) Contact QQ: 645439993 Tel: 13632663118 company to meet market demand as the goal, continuous innovation and dedication to provide customers with quality packaging tape products . Hope that domestic and foreign merchants hand in hand in friendship and cooperation, and create a win-win situation, and create a new era of environmentally friendly packaging, you're welcome to inquire procurement. MG 31 bondplys widely used in bonding the heat sink to the microprocessor and other power consumption of the semiconductor, MG31 bondplys with a strong adhesive strength and thermal resistance small, can effectively replace the grease and mechanical fixing manufacturers can provide free samples of this article URL:. http: //www.hao8.co 24-hour service hotline: Vonnie (Mrs.) 13632663118 Hotline: 0755-84652761 E-mail: 645439993@qq.com QQ: 645439993 The company can customer requirements any punches, dies, cut a variety of shapes, can be arbitrarily cut various widths.