Wire bonders

US KS8028 automatic wire bonders gold wire is mainly used for: 3528,5050 high power 1W, 3W-100W.IC bonding technology parameters are as follows: XY-table limits: 50 * 50mm diameter available: 0.7-3.0mil power : 2.2KVA wire speed: 3.5-4 lines / sec Pressure: 0-500 grams ultrasonic output: 0-255mw pitch: 62um Working pressure: 40Pa-60Pa welding box: 72um solder ball diameter: 2-2.5d chip XY table Maximum stroke: 8 "; x8"; Resolution: 0.3mil PCBXY Table travel range: 8 "; x6"; system accuracy: XY: + _ 3mil Voltage: 110 / 220VAC Frequency: 50 / 60HZ power consumption: 1500W Dimensions : 42 "x34"; x64 "; [LXWXH] Weight: 750kg ASMAD809-06 Bonder supply voltage 220 (V) Power 1500 (W) diameter aluminum wire 120 (μm) Dimensions 640 (mm) Weight 700 (kg)