sop8 lettering -8 -8 feet to the word ic ic the back foot lettering --10 years of professional

Jinshan Xing Electronic Technology Co., processed electronic component package types are as follows: the main package in the form of: SOP, SSOP, DIP, TSOP, QFP, CPU chip, FLASH, BGA, memory, QFN series, TO series, SOT23 series, and other plastic body package chips Heavy and lettering, the Company now has Italian imports of laser equipment 4, the chip surface Heavy machine 4, ancillary equipment several, Nissan 20 million or more, the company currently employs more than 20 people, we adhere to "quality First, commitment, says it will do, timely delivery, the customer first, enthusiastic service, low price "business philosophy, new and old customers for their support and trust, has a good reputation. Welcome to the new and old customers to inquire we send you the best service! ! !