Solderability tester basic information

Solderability tester is the basic information welding filler metals melting point table and the dampening binding between two metal parts forming a metallurgical bonding process: Diffusion: Liquid metal diffusion in the base metal on top of, a contact angle of the substrate formed between the dissolution of the base metal and the liquid solder metal metallic compound (IMC) What is the capacity of the welding effect welding weldability determined by the materials, production processes, storage conditions and the degree of aging. Our welding effect is difficult to predict the ultimate need qualitative measurement but we can accelerate the aging of samples, measured the effect of surface tension physicist Thomas YOUNG and Pierre-Simon LAPLACE found the so-called "; surface tension"; phenomenon, when the following substances: liquid - solid - volatile gases At the same time how solderability test production test visual inspection (dip and look, edge dip test) wetting balance method to derive the diffusion equation LV = flux / melting tin surface tension contact (? 0.4 mN / mm) p = sample week length (mm) q = contact angle g = acceleration due to gravity (9.81 m / s & sup2;) P = solder density (8 mg / mm3) v = sample infiltration volume (mm3) wetting moistening moistening wetting force curve analysis Wetting Force Evaluation criteria -IPC wetting tester MENISCO ST 60 automatic and computer-controlled wettability tester with a tin bath or a tin can measure the components, PCB, and other welding-related elements, such as help flux, metal, solder alloys (including lead-free) measurement results wetting force and wetting angle is represented. http://www.wuma-sh.com/wmdz11-Products-19048347/