Supply of high-power LED chip (integrated) mixing silicone phosphor

First, the product features 1, colorless, transparent liquid, long-term preservation under dark environment. 2, silicon - oxygen (Si-O) bond as the main chain structure, and therefore can not easily be broken down by ultraviolet light and ozone, unparalleled key exists, at high temperatures (or radiation) molecular bond is not broken, you can in -. Long-term use of the range of 50 ℃ ~ 200 ℃. Hardened change after the test 300 ℃ seven days, no cracks, no hardening, cracking colloid by external force can automatically heal. 3, after curing a colorless transparent colloidal jelly for PPA and metal have some good adhesion and sealing. 4, has excellent electrical insulation properties and good sealing. 5, suitable for use as high-power LED phosphors mixed before the gel Item Parameters curing (A component) Appearance colorless liquid Viscosity mPa? S (25 ℃) 8000 before curing (B component) Appearance colorless liquid Viscosity mPa s (25 ℃) 3500 than the column using 1:?? 1 mixture viscosity mPa s (25 ℃) 5000 typical curing conditions 150 ℃ × 3h after curing Appearance transparent elastomer hardness (ShoreA) 50 index of refraction (25 ℃) 1.41 transmittance (%, 450 nm)> 95 Second, the recommended process: different packaging processes, suggested a different ratio, it will get better results. 1, the weight ratio of A: B = 1: 1 ratio with glue, for 8 minutes. 2, vacuum degassed for 10 minutes. 3, prior to dispensing, please stand and a lens at 130 ℃ preheat 60 minutes in addition to wave. 4, the first 80 ℃ bake 1 hour and then heated to bake 120 ℃ 2 hours curing segment bubbles can effectively solve the problem to improve the yield. Third, note should calculate the amount of production with plastic, must be within the operating time of the gum runs out. Agitation with plastic must be uniform, otherwise it will not completely cured affect product performance. This product is a silicone rubber products, using the process and what should be taken to avoid exposure to the substance: organic tin compound and other organometallic compounds; silicone rubber containing organotin compound; sulfur, polysulfide, polysulfone and other sulfur-containing material; amine, urethane or other amine-containing materials; unsaturated hydrocarbon plasticizer