Multi Wire Manufacturers

Multi-line cutting is a wire through the high-speed reciprocating motion, the abrasive grinding into semiconductor processing region, the semiconductor and other brittle materials cut into hundreds of pieces at one time slice of a new cutting method. NC MWS has gradually replaced the traditional cutting of the inner circle, become the main way wafering processing. Based on low-speed cutting precision control of key technology research and development of high-precision CNC multi-line high-speed cutting tools, can fully realize the semiconductor materials and a variety of hard and brittle materials, high-precision, high speed, low loss cutting, to fill the gaps; outcome a number of independent intellectual property rights, the overall technology has reached the international advanced level, tension control, retractable cord synchronous motor and the main motor of the cutting line technology residing in the international advanced level. It is a major producer of silicon materials for semiconductor and photovoltaic field. Multi-line wafer cutting technology is the world's more advanced silicon processing technology, which is different from the conventional saw blades, grinding wheel and other cutting methods, but also from advanced laser cutting and cutting inner circle, it works by a high-speed movement of steel wire attached to the wire drive cutting edge friction material to silicon rods, so as to achieve cutting effect. Throughout the process, the steel wire through a dozen wire guide wheels, forming a wire mesh on the main roller and workpiece to be machined by drop table implementation artifacts feed. Wafer multi-wire cutting technology compared with other technologies: high efficiency, high productivity and high precision. It is currently the most widely used of wafering technology. This article comes from: http: //www.wqdjx.com/