HA copper and copper alloy temperature fast electroless nickel plating solution

HA copper and copper alloy temperature fast electroless nickel plating solution of this product is dedicated to direct chemical copper and copper alloy products, electronic circuits, copper plating layer, a copper printed wiring and other nickel or activation purposes, make copper and copper alloys low temperature nickel products, uniform, fast chemical deposition layer of pure nickel layer for copper, copper alloy products and their rapid preparation dense surface of the powder, bright, corrosion resistance, good adhesion layer of pure nickel. Also available as copper and nickel-plated copper alloy chemical activator before, after this copper electroless nickel plating solution after activation of various nickel-phosphorus alloys, copper and copper alloy surfaces can also act plating, coating evenly, no pinholes hemp Point and drain plating. Eliminate from copper and copper alloy plated surface uneven product surface coating thickness caused by uneven and unnecessary nickel layer is deposited, and unnecessary additional transition layer. Bath stability, long-term recycling, low temperature operation, not particularly suitable for high temperature plastic plating of various electronic products. Available copper and nickel-plated copper alloy chemical additives or copper alloy electroless nickel plating solution and electroless copper plating nickel solution.