Darth Darth supply brand DS-LF1114 room temperature curing conductive silver paste

Darth Darth supply brand DS-LF1114 room temperature curing conductive silver paste Order Tel 13662857438, company website: http: //www.dasijs.com/col.jsp id = 107 DS-LF1114 room temperature curing conductive silver adhesive curing or drying? before, the conductive particles in the adhesive is present in the separation, there is no continuous contact with each other, and thus is insulated. Conductive adhesive curing or drying, by solvent evaporation and adhesive curing adhesive volumetric shrinkage caused by the conductive particles to each other in steady continuous state, thus exhibiting conductivity. DS-LF1114 room temperature curing conductive silver paste applied: (1) used in microelectronics assembly, including fine wires and printed circuits, electroplating floor, ceramic metal layer is sticky, the metal chassis connection, bonding wire and tube holder, bonding components and through the printed circuit flat faces, bonded waveguide tuning and repair the hole. Ability to withstand the spot welding (2) for welding temperature exceeds substituted by welding to form an oxide film. Conductive adhesives as an alternative to tin-lead solder, and its main application areas such as: telephone and mobile communication systems; radio, television, computer and other industries; automotive; medical equipment; solve electromagnetic compatibility (EMC) and so on. (3) Another application is in the ferroelectric devices and the electrode sheet bonded magnet for crystals. Conductive adhesive can be substituted due to soldering flux and crystal deposition temperature tends to welding. Adhesive for battery terminals when the welding temperature is disadvantageous another use conductive adhesive. (4) sufficient strength to form a joint, therefore, can be used as structural adhesives. DS-LF1114 room temperature curing conductive silver paste basic parameters: Chemical composition silver, silver-gray color of the proportion of modified resin solids content of 25 60% viscosity 6 0 0 0 ~ 9 0 0 0 cp s (2 5 ℃ / 1 0 rpm) 1 3 0 ℃ decomposition temperature of the glass transition temperature of 5 5 ℃ shear strength of> 3 M pa impact strength of> 6 K g / 5 0 0 0 pa Operating temperature -. 5 5 ℃ ~ 1 0 0 ℃ volume resistivity 0 0 0 2Ω / CM thermal conductivity 2. 5 w / m 2 ℃ surface curing conditions (0. 1 mm thick) 6 0 ℃ ~ 1 0 0 ℃ 2 0 ~ 4 0 分钟 2 to 5 hours at room temperature