Silicone electronic waterproof plastic
Silicone electronic waterproof plastic
|
I. Summary of AP-9210 is a two component room temperature curing condensation type silicone encapsulants, consists of two parts A, B liquid components. Fluidity before curing, and can be poured into the nuances; room temperature curing, without heating and baking, ethanol molecules released during curing, for PC (Poly-carbonate), PP, ABS, PVC, copper and other materials will not cause corrosion. For most electronic parts and materials (PP, PE excluded) good adhesion. Small shrinkage during curing, no case of fever temperature rise; soft elastomer after curing, good waterproof performance; strong adhesion, adhesion persistence, keeping the rubber in the range of -60 ~ 200 ℃ elasticity, excellent insulation properties. RoHS compliant environmental requirements. UV-resistant materials fully cured after anti-aging properties, good repair, with excellent weather resistance. Second, the technical characteristics of No. Test Item Specification 1 Appearance (after curing) transparent, white, black solid 2 Viscosity (mPa · s, mixed) 700 - 30 003 dry time (min, room temperature) of 20 to 1004 Hardness (Shore A) 10 ~ 50 5 Tear Strength (KN / M)> 0.6 6 Tensile strength (MPa)> 0.6 7 Elongation (%)> 708 Compressive strength (kv / mm)> 10 9 volume resistivity ( Ω · cm) 1.0 × 1013 Note: The above test data room environment. Suffix Color: W (white), B (black), G (gray), R (red), L (transparent). Low viscosity, good leveling, suitable for complex electronic parts molding. After the formation of soft rubber-like solidified, impact resistance. And heat resistance, moisture resistance, excellent cold resistance, can extend the life of the electronic parts after application. · Condensation, prolapse of the ethanol molecules to the components without corrosion. ? This product without the use of other primer, for PC (Polycarbonate), Epoxy and other materials with excellent adhesion. Third, the use of applied LED modules, LED displays, circuit boards and potting protection circuit modules, automotive electronics module, ignition module, electronic components deep potting; LED backlight, lighting, fiber optic cable accessory, HID lamp power module, potting. Especially potting adhesion requirements. The use of methods 1. Weigh: Accurate weighing A, B (before weighing, component A need for proper use of manual or mechanical stirring, component B should be fully shaking the container in a sealed state, and then use); Fair The weight ratio of A: B = 10: 1 ratio if needs change, deal with change mixing proportions simple test application. The amount of the component B of the more general, the shorter the curing time, the shorter the operating time. 2. mixed plastic: the B component is added to Part A homogeneously mixing (mixing time not too long, usually 5-10 minutes); 3. Casting: the mixed plastic material vacuum degassing (general and words, potting thickness 20mm or less naturally degassing, without prior degassing. If the potting large thickness, surface and interior may cause pinholes or bubbles, therefore, should put the mixture into the vacuum container, in 70mmHg defoamed at least 5 minutes); then pour into the parts to complete the potting operation (when required attachment before use to confirm whether the attachment, and then apply, before gluing should be in contact with the substrate surface as necessary cleaning process, should if necessary use the company-specific primer to enhance the adhesion of the colloid and materials); 4. Curing: good potting parts left at room temperature curing, after initial solid to enter the next process, completely cured for an 8 to 24 hours. High summer temperatures, curing will be faster; low winter temperatures, curing will be slower. Before the small molecules produced during the curing process is not completely discharged, the pouring device do not completely closed, plus high temperature (> 100 ℃). If desired completely closed, three days is recommended summer, winter, can be carried out 7 days after closed. After the initial curing adhesive may take appropriate heating (temperature does not exceed 60 ℃) way to accelerate the curing. Fifth, packaging and storage Packaging: 22kg / set (A component 20kg, group B component 2kg), product is non-toxic and non-dangerous goods, according to general chemical handling, transportation, storage in a cool (room temperature), dry place, shelf life of 6 months.
Contact Detail
Company Name: | Shenzhen for the silicone material Limited |
---|---|
Employee Number: | |
Annual export: | |
Year Established: | |
Contact Person: | Mr. Leung(Sales Engineer) |
Telephone Number: | 0755-61149688-8031 |
Company Address: | Shenzhen Bao'an District Samsung industrial area streets Fuhai Road Safety Products Building II, Shenzhen City, Guangdong, China |
Zip/Postal Code: | 518105 |
Find More Related Products
- Dow Corning DC3140 large nu..
- Where shelf thermal grease ..
- Three paint manufacturers o..
- Since the painting from Yip..
- TPU laminated nylon, PET fi..
- 8800 glue
- Three paint manufacturers
- Tai Fung flame temperature ..
- Board-three paint transpare..
- Tai Fung 680 low odor epoxy..
- Three anti-paint coating ci..
- Three paint manufacturers s..
- Three anti-paint industry t..
- Since Yipensanfang paint th..
- LED display potting waterpr..
- Bulb thermal conductivity p..
- Board-three paint proof pai..
- pcb board moisture-proof pa..
- Board since Yipensanfang pa..
- Board-three paint formula
- Circuit board anti-adhesive..