Silicone thermal silica

Features: This product is a neutral through the reinforcement of silicone elastomer gel, both bonding effect, and good thermal conductivity (heat), thermal effect is excellent, with good resistance to high temperature curing adhesive Changes performance, long-term use will not fall off, no contact with the gap, the cooling effect is not reduced. The thermally conductive adhesive has excellent resistance to high temperature performance, temperature is -60 ~ 280 ° c. The thermal silica is a component room temperature curing adhesive. Uses: mainly used in CPU and heat sink, intelligent control thyristor module and heat sink filled adhesive, electrical power module and the heat sink. After this glue can be removed with traditional cards and screw connection, bring results more reliable filling cooling, a simpler process, more economical cost.