Boulder diamond wire saw

Wire diameter deviation diamond size tensile strength 0.11-0.35mm <0.01mm 5μm ~ 6μm 3200 ~ 3400Mpa basic parameters 1, diameter: 0.11 ~ 0.35mm, diameter deviation ≤0.01mm 2, bus bar material: high-strength cutting wire 3, diamond particle size: 5μm ~ 60μm, can be designed according to the requirements 4, tensile strength: 3200 ~ 3400Mpa 5, line length: according to user requirements and manufacturing. Using object diamond wire saw is suitable for monocrystalline silicon, polycrystalline silicon and other semiconductor materials and magnetic materials processing, optical discs, integrated circuits, precision cutting, can also be used for cutting gems, jade and other hard and brittle materials, cut small slits, reducing waste material. Cutting diamond wire saw cutting principle is based on the principle of consolidation in the wire between abrasive and workpiece material cut two-body wear, not directly on the abrasive saw wire, it is a rigid machining methods. Diamond wire cutting characteristics, and the difference compared with other cutting methods 1, compared with the free abrasive wire sawing, diamond wire cutting without the use of mortar, more environmentally friendly production environment, eliminating the environmental problems caused by waste water sludge; at the same time cutting can greatly improve efficiency, overall costs can be significantly reduced. 2, compared with the circular saw and band saw, wire saw cutting direction can be flexibly changed, can be used for machining complex geometries. 3, diamond wire saw is wound around rollers, can simultaneously machined parts (such as silicon rods) were repeatedly cut, and a plurality of workpieces can be processed. 4, is fixed abrasive diamond wire saw cutting, the way you can use low-viscosity coolant, the coolant only chip, so the chip is very easy to recycle, efficiency, energy saving and environmental effect is very obvious. 5, to avoid sintered diamond tool manufacturing process mixing, grain, knot, then (or injection) and other complicated processes. 6, the line saw a small diameter (typically <1mm), when machining cuts loss, it has important implications for the cost of expensive semiconductor and gem processing.