Thermal silica

Description: The product is gray, white two-component fluid, mainly used for electronic potting material class, the product has a good strength and excellent thermal conductivity, for most materials (such as aluminum, ABS, PP, PE etc.) have good adhesion. After 10 metering uniform than mixed, conditional, then evacuated remove air bubbles (also natural discharge bulbs), then potting, and other colloids initial curing or longer: How to use: A and B components by weight of 100 then the product packaging. The main technical parameters: 1 mixture viscosity 4500 --- 5500 2. Operating time: 1.5 hours; 3. initial cure: approximately 6--8 hours; 4. Fully cured: 24 hours 5. Thermal conductivity:> 1.0 ; --- 3.0 6. Dielectric strength:> 27; 7. dielectric constant: 3.1-3.3; 8. volume resistivity:> 1.0 * 1010 silicone encapsulants Features: 1. High strength, high toughness; 2. Good heat resistance, high temperature (long-term use at -35 ℃ ~ 250 ℃), good; 3. To most substrates have good adhesion; 4. Long life, the product life of 10 years, maintenance-free; 5. Anti-oxidation, non-yellowing, product and chemical properties and physically stable; 6. UV resistant to prevent leakage or ultraviolet UV shielding;