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High thermal high adhesion silicone encapsulants

High thermal high adhesion silicone encapsulants
High thermal high adhesion silicone encapsulants
High thermal high adhesion silicone encapsulants

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Company:Shenzhen Jun Taifeng New Materials Co.,
Information Name: High thermal high adhesion silicone encapsulants
Update Time:2015-04-29
Validity:99999
Specifications:
Quantity:
Price Description: RMB/
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Description: Silicone encapsulants by the company to market requirements, after repeated experiments and the development of improved national patent high-tech products. JTF-108 are mainly gray and white types. The product has high strength, high adhesion, moderate flexibility, good insulation and thermal conductivity, anti-flex, anti-oxidation, water resistance, high temperature (long-term use at -40 ~ 220 ℃), resistant to weather and other excellent features. Products and silicone tank, PVC tank, plexiglass, aluminum ducts close bond. With a contraction rate is small, the curing process does not produce stress, good electrical properties, good thermal conductivity, etc. This type of product is suitable for most electronic products potting. How to use: A and B components by weight of 100: 10 (10: 1) The stoichiometric mixing, vacuum remove air bubbles (also natural discharge bulbs), then potting, and other colloids initial curing or longer time after the product packaging. Features: 1. High strength, high toughness; has strong adhesion; 2. Good heat resistance, high temperature (long-term use at -40 ℃ ~ 220 ℃), good; 3. Excellent electrical properties, for most electronic products are applicable; 4. Long life, the product life of 10 years, maintenance-free; 5. UV resistant to prevent leakage or ultraviolet UV shielding; 6. Room temperature curing operation, easy to operate; 7. Excellent stress relief capacity. Note: 1. To use two components are mixed, we must ensure that mixed; 2. If conditions permit, should be carried out row bubble process, if there is no discharge bulbs equipment should be in the mix to stand ten minutes during potting; clean holding container 3. Use, can not be mixed with other encapsulants, curing agent to avoid fire after contact alone sealed, two-component mixed up within your dry time. 
Contact Detail
Company Name: Shenzhen Jun Taifeng New Materials Co.,
Employee Number:
Annual export:
Year Established:
Contact Person: Mr. Yuan Zhijun(Business Manager)
Telephone Number: 0755-29694891
Company Address: 1, Block B of the Thai Industrial Park, Shenzhen Komeito streets of the village of the second industrial zone, Shenzhen City, Guangdong, China
Zip/Postal Code: 518106
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