Electronic Packaging ultrafine spherical silica powder

First, the electronic package with ultrafine silica powder Overview: Electronic Packaging ultrafine silica powder is LSI electronic packaging substrate and the main raw material, which is combined with an epoxy resin together to complete the adhesive seal chips or components solid, ultra-fine silica powder incorporated in a proportion in the epoxy resin determines the thermal expansion coefficients of the substrate, the higher the proportion of silica fume, the smaller the coefficient of thermal expansion of the substrate, to avoid damage to the differential expansion micron wafer lines Therefore, the purity of the silicon powder, fineness and particle size distribution, there are strict requirements. Electronic packaging materials accounted for 80% of epoxy molding compound, silicone encapsulating material accounted for 20%. Second, our product specification sheet: Electronic Packaging Specifications ultrafine silica powder of 400 mesh 600 mesh 800 mesh Head Head 2500 1250 2000 4000 3000 Head Head 5000 Head 6000 Head Head 8000 10,000 head three ultra-fine silica powder Performance Electronic Packaging parameters: a good product fineness (mesh) whiteness hardness (Mohs) Features Electronic Packaging ultrafine silica powder 2000-500092 than 7 fluidity and anti-overflow property