Drying photographic blue oil, anti-corrosion coating machines etch resist ink

Applicable production YB-8330 is recommended for use in the inner layer of fine lines (horizontal coating, and coated with a vertical circulation system of reflux). YB-8330 will apply to acid or alkaline etching solution. YB-8320 for automatic exposure machine. Production Environmental condition Recommended YB-8330 ink at 10000 cleanroom operation to avoid impurities. Coating and drying sections need to 10000 environment. Clean room temperature should be maintained at 22 ± 2 ℃, humidity required to maintain at 55 ± 5%, required under yellow light work. Production operating conditions 1, pre-treatment YB-8330 ink applied to chemical cleaning agents or mechanical brush grinding process, the select key is to let the board clean and chrome residue, the following pre-treatment cleaning methods are already testing done on its manufacturing process, and obtained good results. Three-step chemical cleaning: A, acidic cleaner (sulfuric acid, oxalic acid) B, micro-corrosion agent, micro-erosion rate 20-40microinches C, acid bubbles (micro-etching solution of dissolved salts) mechanical stencilled: alumina and pumice Stucco grinding process can be applied to YB-8330. Acidic cleaning agents are used to remove the board before grinding chromium compounds Wash: final rinse before drying need is deionized water, in order to determine the board no salt residues. Proper washing and drying to avoid water marks remaining on the plate surface. 2. Application of resist: resist Mixing: Stir in production coating method: both sides are coated simultaneously coating temperature: 110-150 ℃ Coating speed: 2.0-5.0m / min coating thickness: 10 ± 2um 3, Drying: YB-8330 has a very wide range of baking. Standard plate surface temperature needs to reach 110-140 ℃ maintain 40s and above. Its purpose is to remove the solvent so that the surface is completely dry. Baking hot air plus its way IR. After baking the thickness of 10 ± 2um. 4, exposure: 5kw-7kw non-parallel light exposure machine resolution capability 2mil minimum line width and line spacing exposure intensity 10mw / C㎡, recommendations must be greater than 20mw / C㎡ energy of about 50-100mj / C㎡ Stouffer Step maintained at 6- 8 grid using the energy grid of the 21 grid sheet number 5, the water-soluble development: the general standard connection type spray developing device developer: concentration: 1.0 ± 0.2% sodium or potassium Temperature: 30 ± 2 ℃ spray pressure: the spray 26 -30psi, under spray 20-25psi residence time: 45-65s, 40-60% of the developing point PH> 10.7 Washing: washing residence time is preferably 1 times or 1.5 times the development time of 50 seconds or more. Water pressure: 25-30psi water temperature: 22 ± 2 ℃ Drying: Drying temperature: 50 ± 2 ℃ Note: If the production of the board directly into the etching bath is not necessary to dry etching 6: YB-8330 can be used to etch acidic Cucl2 . Acid etching conditions redox potential ORP-530MV ± 10MV temperature: 50 ± 2 ℃ copper ion content: 150g / I + 1g / I HCL concentration: 2.5 ± 0.5N spray pressure: 20-30psi YB-8330 can be used for alkaline etching. Alkaline etching conditions: PH: 8.2-8.8 Temperature: 50 ± 2 ℃ copper ion content: 150-180g / I specific gravity: 1.2-1.225 spray pressure: 20-30psi, 7 stripping: stripping Condition: 2-3% hydrogen sodium oxide temperature: 45-55 ℃ spray pressure: 30-40psi stripping time: 30-60 seconds foam is formed: the right amount of anti-foaming agent may need to be filtered Description / Note 1, roll 1) roll and bake Conditions 1.1 The thickness of the ink roller and operating conditions, it is recommended after a dry film thickness 8-12um, its influence thickness factors: the higher the ink viscosity, the thicker the film thickness. Coating nip, the more thick film thickness. Sump greater the gap, the thicker the film thickness. Coated wheel faster speed, the thicker the film thickness. 1.2 set the appropriate frequency automatically add diluent and the amount of each ink viscosity is maintained at an appropriate viscosity and film thickness ranges. 1.3 for automatic horizontal or vertical automatic and manual single roll roller coater machine, the baking temperature and time for the board to reach a temperature above 110 ℃ for at least 40 seconds or more, and then make the necessary cooling. Film thickness, and oven drying conditions to follow the situation make the appropriate adjustments, the above conditions are for reference only. Excessive drying may cause the development of unclean leave residue (SCUM) inadequate drying, coating with the pressure-sensitive viscous, easy to stick the ink film during exposure, causing part of the road when imaging will be washed, can not enter the anti-etch and plating resist. 2) Note 2.1 coating chamber must be kept clean and dust can cause bad line and plagued by 2.2 application work must be in the yellow lighting Interior 2.3 tank when there do not pour ink, please feel free to cover the lid to prevent the viscosity increase 2.4 automatic line roller machine operation stopped for any reason or other causes make the necessary diluted ink viscosity rise, adjust the viscosity or for viscosity control, use of the designated special thinner 2 baking automatic baking: to The actual board temperature reaches 100-120 ℃, 40 seconds or more precautions to follow thickness of 1.1 dry conditions and make the appropriate adjustments oven condition, the above conditions for public reference. 1.2 can cause excessive drying the residue left behind when the significant influence. 1.3 insufficient drying tacky film not withstood exposure film when etching ink easy to stick, except when the noise will partially like, resulting in back etching.