Bonder and automatic wire bonders equipment providers

Rui Feng Technology Co., Ltd. Yushchenko provide PALOMAR 3800 multifunction device automatic Bonder Paste / paste system chip Bonder Overview 3800 3800 Die Bonder is designed for fully automated precision microelectronic assembly equipment. Working strictly controlled by the computer unit of its configuration can be performed up to three dispensing channel, component placement, eutectic patch and flip chip operations, a wide working area more than 35.5 inches x 20 inches. The 3800 placement machine is versatile and powerful system, and can provide special design features in its original function basis. Control structure Bonder groundbreaking 3800 enables users to achieve precise movement control and widely used technology program. Optional pulse head system 3800 Die Bonder - the precision eutectic patch system thermal steady state rail transport device component placement application AuSi friction AuSn eutectic SnPb eutectic solder paste solder perform anisotropic conductive paste (ACP) with high-precision optical components mounted Mount Features 3800 flip chip bonder has a large work area, and configure multiple tips for eutectic soldering steady-state system and pulse heating system, high precision motion system, long dispensing technology, chip ejection and Cognex vision systems. Bonder 3800 with a solid mechanical structure of a new design, process camera, quiet linear motors, 0.1 micron linear XY encoders and direct measure 0.00023 degree rotary encoder. PALOMAR 6500 Automatic Die Bonder Bonder precision component paste / paste system chip Bonder machine Overview 6500 6500 Bonder is a system designed for high-speed, automatic precision component assembly and offers extraordinary micron level positioning Accuracy for optoelectronics, wireless and medical applications. The eutectic chip Bonder is designed for 1.5-micron positioning accuracy (different depending on the application) automatic precision component assembly, so that the element assembly is more practical and less costly. 6500 Bonder has a special optional for wafer level packaging of eutectic die attach. Component mount applications AuSi friction AuSn eutectic PbSn eutectic solder paste solder perform high-precision optical element precision component placement use silver paste P-side down laser pasted wafer level package (WSP) in the 6500 Die Bonder The wafer-level package (WSP) eutectic die attach offers customers a complete microelectronics technology solutions for the P-side down laser diode paste (die-to-wafer). Pulse heating tip for 80/20 Au / Sn pulsed reflux paste, wafer platform steady heating with waffle or gel plate for diode applications. Jingjing round level for a total package of 6500 Die Bonder is designed for automatic, high-speed, high-precision P-Side Down chips - eutectic wafer assembly. Precision image recognition Cognex advanced image recognition system uses a camera to locate the downward laser wafer substrate and N-side location and the ability to enable multiple alignment algorithms, including area, point and boundary alignment. The system includes editable on and off axis illumination system and automatic focus, so to maximize contrast and element positioning accuracy. Microsoft Windows-based operating system environment, the wafer level package Eutectic Die Bonder 6500 software brings a flexible and silent unparalleled ability, as well as easy to use hybrid component assembly. User-friendly interface can help welding setup, operation, diagnostics and calibration. The accuracy of the technical characteristics of the wafer-level package after up to 3 microns, to the front edge and stripe laser position up to 3 sigma integrated camera and laser with laser stripe boundary alignment algorithm ultrahigh accuracy of less than 35 cycles eutectic seconds, including a laser diode for each instant heating and cooling. Optimized single pulse heating tool for special chip size and the required process heating curve, such as P-side down laser paste generation of products Palomar Technologies recently integrated pulse heating curve controllers can be edited and curves perform automatic tracking of wafers and laser diode crawl (Optional) Featured 6 bidirectional tool turret - quick tool change for work in pneumatic bearing table - for precise positioning of the entire work area automatically eutectic chip assembly - with large-capacity, ultra-high precision component placement Bond Data Miner (BDM) and RAM statistics - Provides retrospective component, process the ability to predict and monitor the machine status linear encoders and high-speed linear motor - improving the accuracy and yield a large work area ( 12 "wide x 6" deep) - that is also suitable for high-precision eutectic control small micro circuit board and device - for applications requiring heated to the desired temperature and duration. PALOMAR 8000 automatic wire bonders Wire Bonder high reliability solder bumping and wire bonder 8000 Overview 8000 wire bonders automatic wire bonders are high-speed automatic ultrasonic bonder, can be spherical welding, wafer bumping, chip bumping, as well as customized line arc shape. As a first-level packaging method for interconnecting selected, it is suitable for assembly in many aspects and elements of the package, including complex hybrid circuits, MCMs and high reliability devices. PlanarBump patented technology uses gold to produce wireless tail bumping, also 8000 for flip-chip bonding machines and other advanced packaging applications. The overall accuracy of the depth capacity of 8,000 type bonder in its large working area and can be used inside, resulting in a high yield fine-pitch / high line count application process. 8000 automatic wire bonders optional 8000 ball bonder bonding and bumping line configuration is a unique feature of this system. Bonder 8000 is the only system capable of generating step Co-planarized type gold ball available. This automatic thermal ultrasound, high-speed ball - and - two gold ball welding joints improves product yield, eliminating the source of your process change. Bumping die attach applications camera and camcorder phone MEMS PDAs sensor stacked memory device internal components, such as DSPs, ASICs, SAW filters, high-brightness / high-power LED, CMOS image sensors other general applications in the automotive assembly COB CMOS camera module disk drive assembly displays and solar panels fine pitch devices large, complex flexible circuits hybrid circuit multimode chip pieces (MCMs) Special Features 8000 framework SIPs bonder using a unique wire head movement (double Z- axis rotational movement of patent ) function, by repeating a smooth cut the lead to form a ball on top of the gold ball bumping accurate, will not stay wired tail. This provides a form consistent bumping height of less than 20 microns, which eliminates the need for secondary pressure ball technology. For 8000 bonder key software features include appropriate joints deformed reinforcing wire arc mode, the wireless end bumping and simulation wedge welding (welding chain). 8000 bonder capable of performing the SOS technology. SOS is a user-defined priority in the crescent-dimensional bumping solder interface program. IC to I or welding difficult material will benefit from this feature. Outstanding performance continuous welding technique - carrying wire while the device's ability to crawl on the bonders. The operator thereby eliminating the stop bonding machine and stepper needs. Bonder 8000 highlighted this technology.