Bonding machines dedicated chopper

Xin Yi Electronics Co., Ltd. was established in 2002, since its inception, has always uphold the integrity, professionalism, service and dedication to the values, in just eight years to grow and progress, quality, delivery and service, the price of one advantages, superior performance has made noteworthy share the joy of successful cooperation with you! The company is committed to a professional semiconductor IC packaging and discrete components assembly industry service company, set design, development, production, sales of semiconductor and microelectronics and other various types (WIRE BOND) wire equipment, accessories and supplies, the main products are: gold, aluminum, ceramics chopper, tungsten steel chopper, sparking rod, chopper screws; (DIE BOND) placement equipment, accessories and supplies, products mainly include: tungsten steel nozzle, ceramic nozzle, electrical Wood nozzle, rubber nozzle, tungsten steel thimble, dispensing top. While sales of production ancillary materials LED, COB and related semiconductors used in products mainly include: turning crystal film, gold, aluminum, ceramic nozzle, steel mouth, glue, release agent, molding strips. Our company has established with Singapore, Malaysia, Japan, the United States, South Korea and other related semiconductor supplies manufacturing plants and more than equipment manufacturer partnerships, professional to ASM, K & S, ESEC, KEC, KAIJO, SHINKAWA, TOSOK, PHILIPS, AMI, FOTON, ALPHASEM, NEC, MATSUSHITA, NICHIDEN, TOSHIBA, ZEVATEC, TEXAS INSTRUMENTS, MANUAL VACUUM WAND and other imported equipment ultrasonic wire bonders, die attach electronic equipment and other SMT placement equipment offers a variety of production materials and equipment spare parts while providing professional product design and equipment commissioning, repair and maintenance services.