XRay detection, high-end version proofing

X-Ray detection, high-proofing: PCB unable to look for ways to detect the position, we are using X-Ray tests to ensure product quality, X-Ray is a variation of light intensity based substances of different densities after penetration, resulting contrast image can be formed to show the internal structure of the analyte, the analyte and thus can observe the internal problem areas without the destruction of the analyte. X-Ray Test items: 1. IC package inspection defects such as: layer peeling (stripping), burst (crack), void (cavity) and integrity checking dozen lines; 2. The printed circuit board may have defects in the manufacturing process such as: poor alignment or bridge (bridging) and open (open); 3. SMT solder joint cavity (cavity) phenomenon detection and measurement (measuration). Open (open) 4. kinds of connection lines possible short circuit (short) or abnormal connection defect inspection; 5. solder ball array package and cover-chip package solder ball (solder ball) the integrity of the test; 6 The higher fracture density plastic material (plastic burst) or metal cavity (metal cavity) test; 7. chip size measurement (dimensional measurement), wire line arc measurement, components, eat tin area (Solder area) ratio of the amount test.