2015 Shenzhen Semiconductor Exhibition

 2015 Exhibition of 2015 in Shenzhen, Shenzhen Semiconductor Semiconductor Manufacturing Exhibition 2015 Exhibition 2015 China Shenzhen advanced semiconductor packaging and semiconductor manufacturing Exhibition Show Time: July 29, 2015 --31 days Venue: Shenzhen Convention and Exhibition Center to guide agencies People's Republic of China Ministry of Industry and Information Technology Shenzhen Municipal People's Government Sponsor Shenzhen Electronic Equipment Industry Association jointly sponsored the Shenzhen Municipal Electrical Association Exhibition Co., Ltd. Sponsor China Power Institute of China's electronics industry associations anti-static Branch Automation and Robotics Association Taiwan wisdom Shenzhen Electronics Industries Association, Guangdong SMT IPCC will Dongguan City Hardware International Technology Cooperation Center for Economic CCCME strategic cooperation MIIT China CCPIT Electronics & Information Industry Sub Exhibit: semiconductor manufacturing and advanced packaging technologies, including foundry, traditional IC package, chip stack Stacked Die, package package PiP, packaging the package PoP, fan-out wafer level packaging FO-WLP and silicon vias TSV technology; LED pin package, surface mount package, power type package, COB type packaging. Packaging and testing equipment includes a cutting tool and materials, automatic test equipment, probe cards, packaging materials, wire bonding, flip-chip packaging, welding test; dispenser, solid crystal, wire bonders, separation / sorting machines , spectral detector, cut legs, moisture-proof cabinets, cleaning equipment and automated production equipment. Including lithography equipment for semiconductor manufacturing equipment, measuring and testing equipment, deposition equipment, etching equipment, chemical mechanical polishing (CMP), cleaning equipment, heat treatment equipment, ion implantation equipment, factory automation, factory facilities, Puller, mask production; sapphire and silicon single crystal materials manufacturing equipment, crystal growth process equipment, MOCVD equipment, lithography equipment and Cutting and polishing equipment. Subsystems, components and materials including wire, a laminated substrate, lead frame, plastic materials, plastic patch, feeding board; mass flow control and distribution systems, quartz, graphite and silicon carbide; polycrystalline silicon wafer, light mask, electronic gases and chemicals, photoresist materials and subsidiary materials, CMP slurries, low-K material; LED substrate material, wafer, phosphor, packaging glue, such as stents. Sponsor: Shenzhen Denso Co., Ltd. Shanghai Branch Office Exhibition Association Address: Futian District, Shenzhen, Che Kung Temple days of digital city Tianfa Building, 4th Floor, A2 Contact: Hu Jing 13524398503 E-mail: 3160655206@qq.com QQ: 3160655206